A Brief Review on High-Temperature, Pb-Free Die-Attach Materials

Reliability of AuGe Die Attach on DBC Substrates With Different Ni Surface Finishes

(2017) Jinzi Cui et al.   IEEE Transactions on Components Packaging and Manufacturing Technology

SiC Power Device Die Attach for Extreme Environments

(2015) Zhenzhen Shen et al.   IEEE TRANSACTIONS ON ELECTRON DEVICES

Review on Joint Shear Strength of Nano-Silver Paste and Its Long-Term High Temperature Reliability

(2014) R. Khazaka et al.   JOURNAL OF ELECTRONIC MATERIALS

Three-Dimensional Visualization of the Crack-Growth Behavior of Nano-Silver Joints During Shear Creep

(2014) Yansong Tan et al.   JOURNAL OF ELECTRONIC MATERIALS

Three-Layer Zn/Al/Zn Clad Solder for Die Attachment

(2014) T. Yamaguchi et al.   JOURNAL OF ELECTRONIC MATERIALS

Are Sintered Silver Joints Ready for Use as Interconnect Material in Microelectronic Packaging?

(2014) Kim S. Siow   JOURNAL OF ELECTRONIC MATERIALS

Development of high-temperature solders: Review

(2012) Guang Zeng et al.   MICROELECTRONICS RELIABILITY

Die Attach Materials for High Temperature Applications: A Review

(2011) V R Manikam et al.   IEEE Transactions on Components Packaging and Manufacturing Technology

Kinetics of Ag3Sn growth in Ag–Sn–Ag system during transient liquid phase soldering process

(2010) J.F. Li et al.   ACTA MATERIALIA

Low-Temperature Sintering of Nanoscale Silver Paste for Attaching Large-Area $({>}100~{\rm mm}^{2})$ Chips

(2009) T.G. Lei et al.   IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES

Microstructure of eutectic 80Au/20Sn solder joint in laser diode package

(2007) J.W. Ronnie Teo et al.   MICROELECTRONIC ENGINEERING