Low temperature and pressureless Cu-to-Cu direct bonding by green synthesized Cu nanoparticles
出版年份 2021 全文链接
标题
Low temperature and pressureless Cu-to-Cu direct bonding by green synthesized Cu nanoparticles
作者
关键词
Cu nanoparticle synthesis, Green chemistry, Cu oxide reduction, Sintering, Low temperature bonding, Power electronic packaging
出版物
Journal of the Taiwan Institute of Chemical Engineers
Volume 125, Issue -, Pages 394-401
出版商
Elsevier BV
发表日期
2021-06-26
DOI
10.1016/j.jtice.2021.06.026
参考文献
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