Silicon Carbide Converters and MEMS Devices for High-temperature Power Electronics: A Critical Review

Venus nightside surface temperature

(2019) D. Singh   Scientific Reports

Thermal modeling and comparative analysis of jet impingement liquid cooling for high power electronics

(2019) Ruikang Wu et al.   INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER

A High-Temperature Gate Driver for Silicon Carbide mosfet

(2018) Parthasarathy Nayak et al.   IEEE TRANSACTIONS ON INDUSTRIAL ELECTRONICS

Influence of solvent selection and extraction temperature on yield and composition of lipids extracted from spent coffee grounds

(2018) Ioannis Efthymiopoulos et al.   INDUSTRIAL CROPS AND PRODUCTS

Lead-Free Alternatives for Interconnects in High-Temperature Electronics

(2018) Sandeep Mallampati et al.   JOURNAL OF ELECTRONIC PACKAGING

Hybrid Nanocomposite Thermal Interface Materials: The Thermal Conductivity and the Packing Density

(2018) Tingting Zhang et al.   JOURNAL OF ELECTRONIC PACKAGING

Review of Thermal Packaging Technologies for Automotive Power Electronics for Traction Purposes

(2018) Justin Broughton et al.   JOURNAL OF ELECTRONIC PACKAGING

Design Considerations for 4H-SiC Lateral BJTs for High Temperature Logic Applications

(2018) Amna Siddiqui et al.   IEEE Journal of the Electron Devices Society

500°C SiC PWM Integrated Circuit

(2018) Saleh Kargarrazi et al.   IEEE TRANSACTIONS ON POWER ELECTRONICS

A Fully Integrated Silicon-Carbide Sigma–Delta Modulator Operating up to 500 °C

(2017) Ye Tian et al.   IEEE TRANSACTIONS ON ELECTRON DEVICES

Development of a High-Temperature Gate Drive and Protection Circuit Using Discrete Components

(2017) Feng Qi et al.   IEEE TRANSACTIONS ON POWER ELECTRONICS

Review of spray cooling – Part 1: Single-phase and nucleate boiling regimes, and critical heat flux

(2017) Gangtao Liang et al.   INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER

Application of SiC power electronic devices in secondary power source for aircraft

(2017) Qian Xun et al.   RENEWABLE & SUSTAINABLE ENERGY REVIEWS

Thermal Flow Sensors for Harsh Environments

(2017) Vivekananthan Balakrishnan et al.   SENSORS

Influences of Device and Circuit Mismatches on Paralleling Silicon Carbide MOSFETs

(2016) Helong Li et al.   IEEE TRANSACTIONS ON POWER ELECTRONICS

Characterization of transferred vertically aligned carbon nanotubes arrays as thermal interface materials

(2016) Melissa A. Peacock et al.   INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER

Thermal Modeling of Extreme Heat Flux Microchannel Coolers for GaN-on-SiC Semiconductor Devices

(2016) Hyoungsoon Lee et al.   JOURNAL OF ELECTRONIC PACKAGING

Thermal Response of Multi-Microchannel Evaporators During Flow Boiling of Refrigerants Under Transient Heat Loads With Flow Visualization

(2016) Houxue Huang et al.   JOURNAL OF ELECTRONIC PACKAGING

A review of micro-contact physics, materials, and failure mechanisms in direct-contact RF MEMS switches

(2016) A Basu et al.   JOURNAL OF MICROMECHANICS AND MICROENGINEERING

SiC Power Device Die Attach for Extreme Environments

(2015) Zhenzhen Shen et al.   IEEE TRANSACTIONS ON ELECTRON DEVICES

500 °C Bipolar SiC Linear Voltage Regulator

(2015) Saleh Kargarrazi et al.   IEEE TRANSACTIONS ON ELECTRON DEVICES

SiC Integrated Circuit Control Electronics for High-Temperature Operation

(2015) Mihaela Alexandru et al.   IEEE TRANSACTIONS ON INDUSTRIAL ELECTRONICS

A High Temperature Silicon Carbide mosfet Power Module With Integrated Silicon-On-Insulator-Based Gate Drive

(2015) Zhiqiang Wang et al.   IEEE TRANSACTIONS ON POWER ELECTRONICS

Gate and Base Drivers for Silicon Carbide Power Transistors: An Overview

(2015) Dimosthenis Peftitsis et al.   IEEE TRANSACTIONS ON POWER ELECTRONICS

Survey of High-Temperature Reliability of Power Electronics Packaging Components

(2015) R. Khazaka et al.   IEEE TRANSACTIONS ON POWER ELECTRONICS

High lead solder (over 85 %) solder in the electronics industry: RoHS exemptions and alternatives

(2015) Sandeep Menon et al.   JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS

A review of high-temperature electronics technology and applications

(2015) Jeff Watson et al.   JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS

The Piezoresistive Effect of SiC for MEMS Sensors at High Temperatures: A Review

(2015) Hoang-Phuong Phan et al.   JOURNAL OF MICROELECTROMECHANICAL SYSTEMS

Power electronics with wide bandgap materials: Toward greener, more efficient technologies

(2015) Francesca Iacopi et al.   MRS BULLETIN

Integrated circuits in silicon carbide for high-temperature applications

(2015) Carl-Mikael Zetterling   MRS BULLETIN

Flexible high-temperature dielectric materials from polymer nanocomposites

(2015) Qi Li et al.   NATURE

Survey of High-Temperature Polymeric Encapsulants for Power Electronics Packaging

(2015) Yiying Yao et al.   IEEE Transactions on Components Packaging and Manufacturing Technology

Silicon Carbide Integrated Circuits With Stable Operation Over a Wide Temperature Range

(2014) Reza Ghandi et al.   IEEE ELECTRON DEVICE LETTERS

A Monolithic, 500 °C Operational Amplifier in 4H-SiC Bipolar Technology

(2014)   IEEE ELECTRON DEVICE LETTERS

An All-SiC High-Frequency Boost DC–DC Converter Operating at 320 °C Junction Temperature

(2014) Xueqian Zhong et al.   IEEE TRANSACTIONS ON POWER ELECTRONICS

Improved Operation of SiC–BJT-Based Series Resonant Inverter With Optimized Base Drive

(2014) Hector Sarnago et al.   IEEE TRANSACTIONS ON POWER ELECTRONICS

Are Sintered Silver Joints Ready for Use as Interconnect Material in Microelectronic Packaging?

(2014) Kim S. Siow   JOURNAL OF ELECTRONIC MATERIALS

500$^{\circ}{\rm C}$ Bipolar Integrated OR/NOR Gate in 4H-SiC

(2013) Luigia Lanni et al.   IEEE ELECTRON DEVICE LETTERS

A Novel Hybrid Packaging Structure for High-Temperature SiC Power Modules

(2013) Ruxi Wang et al.   IEEE TRANSACTIONS ON INDUSTRY APPLICATIONS

High-Bandwidth High-Temperature (250 °C/500 °F) Isolated DC and AC Current Measurement: Bidirectionally Saturated Current Transformer

(2013) B. Wrzecionko et al.   IEEE TRANSACTIONS ON POWER ELECTRONICS

A 4H Silicon Carbide Gate Buffer for Integrated Power Systems

(2013) Nance Ericson et al.   IEEE TRANSACTIONS ON POWER ELECTRONICS

A 1200-V, 60-A SiC MOSFET Multichip Phase-Leg Module for High-Temperature, High-Frequency Applications

(2013) Zheng Chen et al.   IEEE TRANSACTIONS ON POWER ELECTRONICS

Forced-Air Cooling System Design Under Weight Constraint for High-Temperature SiC Converter

(2013) Puqi Ning et al.   IEEE TRANSACTIONS ON POWER ELECTRONICS

A SiC NMOS Linear Voltage Regulator for High-Temperature Applications

(2013) Javier A. Valle-Mayorga et al.   IEEE TRANSACTIONS ON POWER ELECTRONICS

A 55-kW Three-Phase Inverter Based on Hybrid-Switch Soft-Switching Modules for High-Temperature Hybrid Electric Vehicle Drive Application

(2012) Pengwei Sun et al.   IEEE TRANSACTIONS ON INDUSTRY APPLICATIONS

A 200 °C Universal Gate Driver Integrated Circuit for Extreme Environment Applications

(2012) Mohammad A. Huque et al.   IEEE TRANSACTIONS ON POWER ELECTRONICS

Development of a SiC JFET-Based Six-Pack Power Module for a Fully Integrated Inverter

(2012) Fan Xu et al.   IEEE TRANSACTIONS ON POWER ELECTRONICS

Design and Performance Evaluation of a 200 °C Interleaved Boost Converter

(2012) Hiroyuki Kosai et al.   IEEE TRANSACTIONS ON POWER ELECTRONICS

A High-Temperature SiC Three-Phase AC–DC Converter Design for >$100 ^{\circ}$C Ambient Temperature

(2012) Ruxi Wang et al.   IEEE TRANSACTIONS ON POWER ELECTRONICS

Overview of Electric Motor Technologies Used for More Electric Aircraft (MEA)

(2011) Wenping Cao et al.   IEEE TRANSACTIONS ON INDUSTRIAL ELECTRONICS

Overview of transient liquid phase and partial transient liquid phase bonding

(2011) Grant O. Cook et al.   JOURNAL OF MATERIALS SCIENCE

Preliminary evaluation of the influence of the temperature on the performance of a piezoresistive pressure sensor based on a-SiC film

(2011) M. A. Fraga et al.   MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS

Die Attach Materials for High Temperature Applications: A Review

(2011) V R Manikam et al.   IEEE Transactions on Components Packaging and Manufacturing Technology

A Novel High-Temperature Planar Package for SiC Multichip Phase-Leg Power Module

(2010) Puqi Ning et al.   IEEE TRANSACTIONS ON POWER ELECTRONICS

Silicon-on-insulator-based high-voltage, high-temperature integrated circuit gate driver for silicon carbide-based power field effect transistors

(2010) M.A. Huque et al.   IET Power Electronics

State of the art of high temperature power electronics

(2010) Cyril Buttay et al.   Materials Science and Engineering B-Advanced Functional Solid-State Materials

Electromechanical Computing at 500°C with Silicon Carbide

(2010) Te-Hao Lee et al.   SCIENCE

Influence of manganese substitution and annealing temperature on the formation, microstructure and magnetic properties of Mn–Zn ferrites

(2008) M.M. Hessien et al.   JOURNAL OF MAGNETISM AND MAGNETIC MATERIALS

Demonstration of the first SiC power integrated circuit

(2008) Kuang Sheng et al.   SOLID-STATE ELECTRONICS