Article
Engineering, Electrical & Electronic
Samantha Jones-Jackson, Romina Rodriguez, Yuhang Yang, Luis Lopera, Ali Emadi
Summary: The design of thermal management solutions has a significant impact on the reliability and power density of power electronics in electric vehicles (EVs). This article reviews the thermal management strategies and failure modes of major power electronic components in EVs, as well as current cooling designs and future cooling trends for the next generation of power electronics.
IEEE TRANSACTIONS ON TRANSPORTATION ELECTRIFICATION
(2022)
Article
Engineering, Electrical & Electronic
L. Anoldo, G. Malta, B. Mazza, G. G. Piccione, M. Calabretta, S. Russo, A. Russo, A. Sitta, A. Messina, A. Lionetto, S. Patan
Summary: Nowadays, there is a growing demand for high-efficiency power devices in automotive frameworks, which has driven the scientific community to develop new technologies that can operate under intense power loads. SiC-based substrates are seen as a promising solution in this broad scenario. This study focuses on the high-speed thermal characterization of a power module (ACEPACK DRIVE) designed by STMicroelectronics, aiming to provide a map of the temperature values reached at the surface under current-pulse stresses. Thermal images collected on one leg show a symmetrical temperature distribution, with a maximum temperature of around 60 degrees Celsius on the device metals, ensuring that any reliability issues due to thermomechanical stress are avoided.
MICROELECTRONICS RELIABILITY
(2022)
Article
Automation & Control Systems
Samuel S. Queiroz, Demercil de S. Oliveira, Paulo P. Praca, Luis H. S. C. Barreto
Summary: This study investigates the generalized cascaded full-bridge concept, which aims to reduce stress on semiconductors and provide flexible design options. The structures introduced have the potential to improve performance in high-power applications by reducing losses in power semiconductors and the number of devices required.
IEEE TRANSACTIONS ON INDUSTRIAL ELECTRONICS
(2022)
Article
Energy & Fuels
Amro Al-Qutub, Tahar Laoui, Ghazi Zulhazmi, Mohammed Abdul Samad
Summary: This study evaluates the performance of three different materials, alumina, silicon carbide, and siliconized silicon carbide, in thermal fatigue experiments and determines that silicon carbide and siliconized silicon carbide have better durability for solar absorber applications.
Article
Engineering, Multidisciplinary
Mohammed Agamy, Fengfeng Tao, Ahmed Elasser
Summary: This article presents the development and characteristics of 3 kV SiC thyristors, along with a novel current-source gate driver to enhance their switching speed and limit the peak of the current pulse. The higher gate current slew rate achieves faster and more efficient device switching transition for pulsed power applications.
IEEE TRANSACTIONS ON INDUSTRY APPLICATIONS
(2021)
Article
Materials Science, Ceramics
Bola Yoon, Dylan Richardson, Saad A. Jajja, Corson L. Cramer, Michael J. Lance, Kashif Nawaz, Edgar Lara-Curzio
Summary: A study investigated the environmental stability of materials in hybrid energy systems and focused on siliconized silicon carbide (Si-SiC) prepared via additive manufacturing. The results showed that the oxide scales formed on the surface were dense and continuous, but exhibited some cracking due to thermal expansion mismatches. The study discussed the potential effects of silica volatilization induced by water vapor and silica reduction when exposed to hydrogen, and concluded that the oxide scale is expected to provide protection in hybrid power generation systems.
JOURNAL OF THE AMERICAN CERAMIC SOCIETY
(2023)
Article
Automation & Control Systems
Vicente Esteve, Jose Jordan, Enrique J. Dede, Esteban Sanchis-Kilders, Pedro J. Martinez, Enrique Maset, David Gilabert
Summary: This article presents the analysis and optimal design method of a converter based on an LLC resonant output inverter for induction heating applications. The optimal design method improves operating parameters and achieves an optimal power factor. The converter, made with silicon carbide MOSFET transistors, achieves an efficiency greater than 99%.
IEEE TRANSACTIONS ON INDUSTRIAL ELECTRONICS
(2022)
Article
Chemistry, Physical
Wei Zhang
Summary: Boron carbide-silicon carbide ceramic is a high-performance tribological structural material with in situ formed relief structure, which improves its tribological properties and shows promising potential for various applications.
ADVANCES IN COLLOID AND INTERFACE SCIENCE
(2022)
Review
Materials Science, Ceramics
Alexander B. Dresch, Janio Venturini, Sabrina Arcaro, Oscar R. K. Montedo, Carlos P. Bergmann
Summary: This review compares the most commonly used ballistic ceramics, including alumina, silicon carbide, and boron carbide, in terms of various performance mechanisms. It aims to study the mechanical properties of ceramics and their role in dynamic ballistic performance to address the controversy in the literature. The study found that silicon carbide performs best against 7.62 AP projectiles, with hardness and flexural strength correlated to ceramics' performance in depth of penetration tests, demonstrating the dependence of ceramics' ballistic performance on multiple properties.
CERAMICS INTERNATIONAL
(2021)
Review
Chemistry, Physical
Haiyan Ou, Xiaodong Shi, Yaoqin Lu, Manuel Kollmuss, Johannes Steiner, Vincent Tabouret, Mikael Syvajarvi, Peter Wellmann, Didier Chaussende
Summary: Silicon carbide (SiC) is rapidly advancing in novel photonic applications due to advancements in nanotechnologies and its exceptional optical properties. This review provides an introduction to the optical properties of SiC and discusses the importance of the silicon carbide on insulator stack (SiCOI) structure for light confinement and interaction in optical cavities. Various photonic cavities are summarized in terms of quality factor, volume, and polytypes. The review also addresses the challenges of CMOS compatibility and low-loss material growth for SiC photonic application. Lastly, the potential of SiC as a competitive platform for quantum photonic integrated circuits is discussed, along with its future prospects and impacts.
Review
Engineering, Environmental
Esra Eray, Victor M. Candelario, Vittorio Boffa, Hamed Safafar, David N. Ostedgaard-Munck, Nanette Zahrtmann, Haris Kadrispahic, Mads K. Jorgensen
Summary: This review paper discusses the important role of silicon carbide membranes in addressing water scarcity and water pollution issues, focusing on the preparation methods, advantages and disadvantages, and application areas of silicon carbide membranes. It also emphasizes the influence of key aspects in the preparation of silicon carbide supports on membrane performance.
CHEMICAL ENGINEERING JOURNAL
(2021)
Article
Optics
Alexandr Belosludtsev, Deividas Buinovskis
Summary: An optimized multilayer coating approach was suggested to significantly increase the UV range reflectivity of SiC mirrors. The study also demonstrated how to optimize coating designs for high-power laser systems and improve the flatness of SiC without affecting coating roughness. The coatings passed high-temperature annealing, humidity chamber, and scotch-tape tests required for final application.
OPTICS AND LASER TECHNOLOGY
(2021)
Article
Crystallography
Sepideh Hemati, Smitirupa Biswal, Farshid Pahlevani, Sanjith Udayakumar, Veena Sahajwalla
Summary: This study investigates the synthesis of silicon carbide (SiC) using automotive shredder residues (ASR) and glass wastes as raw materials. The results show that the reaction mechanism involves the rapid formation of a gaseous SiO intermediate and the reaction-rate-controlling carbon reduction of SiO to SiC. By optimizing the reaction conditions, about 50% of chemical energy can be saved compared to traditional SiC production, offering economic and environmental benefits by converting ASR and glass waste into SiC.
Article
Engineering, Electrical & Electronic
Fengtao Yang, Lixin Jia, Laili Wang, Fan Zhang, Binyu Wang, Cheng Zhao, Jianpeng Wang, Christoph Friedrich Bayer, Jan Abraham Ferreira
Summary: Double-sided cooling based on planar packaging method outperforms traditional single-sided cooling based on wire bonds. However, it still faces thermal and electrical challenges in multichip SiC power modules. This article proposes an interleaved planar packaging method to address the optimization contradiction between thermal and electrical performance and enhance the current capability and reliability of power modules.
IEEE TRANSACTIONS ON POWER ELECTRONICS
(2022)
Review
Materials Science, Ceramics
Yiyuan Wang, Shun Dong, Xiutao Li, Changqing Hong, Xinghong Zhang
Summary: This article provides a comprehensive overview on the synthesis, properties and potential applications of silicon carbide (SiC) nanoparticles. It discusses various synthesis techniques, highlights the unique properties of SiC nanoparticles, and discusses their diversified applications. The article is informative and valuable for research in the field.
CERAMICS INTERNATIONAL
(2022)
Article
Engineering, Electrical & Electronic
Nathan Kuhns, Landon Caley, Ashfaqur Rahman, Shamim Ahmed, Jia Di, H. Alan Mantooth, A. Matthew Francis, James Holmes
IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY
(2016)
Article
Engineering, Electrical & Electronic
Ashfaqur Rahman, Anthony Matt Francis, Shamim Ahmed, Sai Kiran Akula, Jim Holmes, Alan Mantooth
IEEE TRANSACTIONS ON ELECTRON DEVICES
(2016)
Article
Engineering, Electrical & Electronic
Ashfaqur Rahman, Sajib Roy, Robert Murphree, Ramchandra Kotecha, Kyle Addington, Affan Abbasi, Homer A. Mantooth, Anthony Matt Francis, Jim Holmes, Jia Di
IEEE JOURNAL OF EMERGING AND SELECTED TOPICS IN POWER ELECTRONICS
(2016)
Article
Engineering, Electrical & Electronic
Ashfaqur Rahman, Landon Caley, Sajib Roy, Nathan Kuhns, Alan Mantooth, Jia Di, Anthony M. Francis, Jim Holmes
IEEE TRANSACTIONS ON ELECTRON DEVICES
(2017)
Article
Automation & Control Systems
Sajib Roy, Robert C. Murphree, Affan Abbasi, Ashfaqur Rahman, Shamim Ahmed, James Austin Gattis, A. Matt Francis, Jim Holmes, H. Alan Mantooth, Jia Di
IEEE TRANSACTIONS ON INDUSTRIAL ELECTRONICS
(2017)
Proceedings Paper
Engineering, Electrical & Electronic
S. Roy, R. C. Murphee, A. Abbasi, A. Rahman, H. A. Mantooth, J. Di, A. M. Francis, J. Holmes
2016 IEEE 4TH WORKSHOP ON WIDE BANDGAP POWER DEVICES AND APPLICATIONS (WIPDA)
(2016)
Proceedings Paper
Engineering, Aerospace
A. Matthew Francis, Tyler Moudy, James A. Holmes, Ashfaqur Rahman, Matthew Barlow, Shamim Ahmed, Alan Mantooth
2015 IEEE AEROSPACE CONFERENCE
(2015)
Proceedings Paper
Engineering, Electrical & Electronic
A. Rahman, K. Addington, M. Barlow, S. Ahmed, H. A. Mantooth, A. M. Francis
WIPDA 2015 3RD IEEE WORKSHOP ON WIDE BANDGAP POWER DEVICES AND APPLICATIONS
(2015)
Proceedings Paper
Engineering, Electrical & Electronic
A. Rahman, S. Roy, R. C. Murphree, H. A. Mantooth, A. M. Francis, J. Holmes
WIPDA 2015 3RD IEEE WORKSHOP ON WIDE BANDGAP POWER DEVICES AND APPLICATIONS
(2015)