Wide Bandgap Technologies and Their Implications on Miniaturizing Power Electronic Systems

Datasheet Driven Silicon Carbide Power MOSFET Model

(2014) Mihir Mudholkar et al.   IEEE TRANSACTIONS ON POWER ELECTRONICS

Characterization and Modeling of 4H-SiC Lateral MOSFETs for Integrated Circuit Design

(2013) Mihir Mudholkar et al.   IEEE TRANSACTIONS ON ELECTRON DEVICES

An All-SiC Three-Phase Buck Rectifier for High-Efficiency Data Center Power Supplies

(2013) Fan Xu et al.   IEEE TRANSACTIONS ON INDUSTRY APPLICATIONS

A 4H Silicon Carbide Gate Buffer for Integrated Power Systems

(2013) Nance Ericson et al.   IEEE TRANSACTIONS ON POWER ELECTRONICS

A SiC NMOS Linear Voltage Regulator for High-Temperature Applications

(2013) Javier A. Valle-Mayorga et al.   IEEE TRANSACTIONS ON POWER ELECTRONICS

Practical Design and Implementation Procedure of an Interleaved Boost Converter Using SiC Diodes for PV Applications

(2012) Carl Ngai-Man Ho et al.   IEEE TRANSACTIONS ON POWER ELECTRONICS

High-Temperature Silicon-on-Insulator Gate Driver for SiC-FET Power Modules

(2012) Javier Valle-Mayorga et al.   IEEE TRANSACTIONS ON POWER ELECTRONICS

Review of Integrated Magnetics for Power Supply on Chip (PwrSoC)

(2012) C. O. Mathúna et al.   IEEE TRANSACTIONS ON POWER ELECTRONICS

A High-Temperature SiC Three-Phase AC–DC Converter Design for >$100 ^{\circ}$C Ambient Temperature

(2012) Ruxi Wang et al.   IEEE TRANSACTIONS ON POWER ELECTRONICS

Nickel–Tin Transient Liquid Phase Bonding Toward High-Temperature Operational Power Electronics in Electrified Vehicles

(2012) Sang Won Yoon et al.   IEEE TRANSACTIONS ON POWER ELECTRONICS

High-Frequency High Power Density 3-D Integrated Gallium-Nitride-Based Point of Load Module Design

(2012) Shu Ji et al.   IEEE TRANSACTIONS ON POWER ELECTRONICS

Design and Evaluation of a High-Frequency LTCC Inductor Substrate for a Three-Dimensional Integrated DC/DC Converter

(2012) Yipeng Su et al.   IEEE TRANSACTIONS ON POWER ELECTRONICS

Reliable and repeatable bonding technology for high temperature automotive power modules for electrified vehicles

(2012) Sang Won Yoon et al.   JOURNAL OF MICROMECHANICS AND MICROENGINEERING

Characterization of Encapsulants for High-Voltage High-Temperature Power Electronic Packaging

(2012) Yiying Yao et al.   IEEE Transactions on Components Packaging and Manufacturing Technology

Temperature Cycling Reliability of High-Temperature Lead-Free Die-Attach Technologies

(2011) Pedro O. Quintero et al.   IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY

Impact of SiC Devices on Hybrid Electric and Plug-In Hybrid Electric Vehicles

(2011) Hui Zhang et al.   IEEE TRANSACTIONS ON INDUSTRY APPLICATIONS

Automatic layout design for power module

(2011) Puqi Ning et al.   IEEE TRANSACTIONS ON POWER ELECTRONICS

Efficiency Impact of Silicon Carbide Power Electronics for Modern Wind Turbine Full Scale Frequency Converter

(2010) Hui Zhang et al.   IEEE TRANSACTIONS ON INDUSTRIAL ELECTRONICS

Silicon-on-insulator-based high-voltage, high-temperature integrated circuit gate driver for silicon carbide-based power field effect transistors

(2010) M.A. Huque et al.   IET Power Electronics

GaN Power Transistors on Si Substrates for Switching Applications

(2010) Nariaki Ikeda et al.   PROCEEDINGS OF THE IEEE