Article
Engineering, Electrical & Electronic
Lanbing Liu, David Nam, Ben Guo, Jeffrey Ewanchuk, Rolando Burgos, Guo-Quan Lu
Summary: The study evaluated the feasibility of using low-melting-point lead glass as a high-temperature encapsulant and developed a stress-relief solution to prevent glass cracking. Measurements showed that the glass-encapsulated SiC power modules exhibited good electrical insulation performance and normal characteristics at 250 degrees C.
IEEE JOURNAL OF EMERGING AND SELECTED TOPICS IN POWER ELECTRONICS
(2021)
Article
Chemistry, Physical
Qiang Jia, Guisheng Zou, Hongqiang Zhang, Zhongyang Deng, Wengan Wang, Lei Liu, Limin Ma, Fu Guo
Summary: In this work, a super-saturated Ag2.8 wt%Cu nanoalloy film was fabricated using pulsed laser deposition. The thermal stability and electrochemical migration resistance of the nanoalloy were significantly improved by alloying Ag with 2.8 wt% Cu. The synergistic effect between Ag-Cu nanoalloy and Cu oxides provided a protective effect during anodic dissolution.
APPLIED SURFACE SCIENCE
(2023)
Article
Engineering, Electrical & Electronic
Y. Chen, A. Iradukunda, H. A. Mantooth, Z. Chen, D. Huitink
Summary: Transportation electrification and grid modernization efforts require power electronic converters, motor drives, and protection systems to meet stringent requirements for power densities. This article provides a tutorial on designing and realizing high-power modules, using the PowerAmerica (PA) module challenge as an example. It discusses the application-driven development process, challenges in multidimensional design, and technologies and strategies for high-power, high-density module realization. The knowledge shared can facilitate the prototype development of new power modules.
IEEE JOURNAL OF EMERGING AND SELECTED TOPICS IN POWER ELECTRONICS
(2023)
Article
Chemistry, Applied
Milad Jafarpour, Milad Fathi, Nafiseh Soltanizadeh
Summary: Encapsulated PCM has been developed for thermal buffering in food packaging. The encapsulated PEG exhibited decreased crystallization temperature and melting enthalpy. The encapsulation process improved the thermal stability of PCM. Encapsulated PCM was effective in controlling temperature fluctuation and preserving the quality of perishable food.
FOOD HYDROCOLLOIDS
(2023)
Article
Engineering, Electrical & Electronic
Fengtao Yang, Lixin Jia, Laili Wang, Fan Zhang, Binyu Wang, Cheng Zhao, Jianpeng Wang, Christoph Friedrich Bayer, Jan Abraham Ferreira
Summary: Double-sided cooling based on planar packaging method outperforms traditional single-sided cooling based on wire bonds. However, it still faces thermal and electrical challenges in multichip SiC power modules. This article proposes an interleaved planar packaging method to address the optimization contradiction between thermal and electrical performance and enhance the current capability and reliability of power modules.
IEEE TRANSACTIONS ON POWER ELECTRONICS
(2022)
Article
Materials Science, Multidisciplinary
Sangeeta, Ramesh Kumar, Mukhtiyar Singh
Summary: This study investigates the structural, elastic, electronic, and thermoelectric properties of RbZn4P3, and finds that it has excellent potential as a thermoelectric energy harvesting material.
JOURNAL OF MATERIALS SCIENCE
(2022)
Article
Multidisciplinary Sciences
Chong Liu, Ryan P. Day, Fengmiao Li, Ryan L. Roemer, Sergey Zhdanovich, Sergey Gorovikov, Tor M. Pedersen, Juan Jiang, Sangjae Lee, Michael Schneider, Doug Wong, Pinder Dosanjh, Frederick J. Walker, Charles H. Ahn, Giorgio Levy, Andrea Damascelli, George A. Sawatzky, Ke Zou
Summary: The enhanced superconductivity in monolayer FeSe/SrTiO3 has been extensively studied over the past decade, with a focus on the replica bands in the photoemission spectrum. The authors conducted angle-resolved photoemission spectroscopy measurements and found unexpectedly high-intensity replica bands derived from various Fe 3d bands, providing new insights into the electronic structure and physical origin of the photoemission replica bands in this high-temperature superconductor.
NATURE COMMUNICATIONS
(2021)
Article
Materials Science, Multidisciplinary
Jiajie Fan, Dawei Jiang, Hao Zhang, Dong Hu, Xu Liu, Xuejun Fan, Guoqi Zhang
Summary: This study assessed the mechanical properties of sintered nano-copper particles using high-temperature nanoindentation tests. The results showed that the hardness and indentation modulus of the particles increased with loading rate up to a certain point and decreased with increased applied load. A plastic stress-strain constitutive model for the particles at room temperature was obtained. The high-temperature nanoindentation tests revealed the impact of assisted pressure on the temperature sensitivity of hardness and indentation modulus, as well as the relationship between creep rate and creep resistance of sintered nano-copper particles under high temperature conditions.
RESULTS IN PHYSICS
(2022)
Article
Materials Science, Multidisciplinary
Fengyi Wang, Xinjie Wang, Xingchao Mao, Fangcheng Duan, Chunjin Hang, Hongtao Chen, Mingyu Li
Summary: In this study, a novel type of submicron Sn-coated Zn particles was proposed as a potential die-attach material for high-temperature power device packaging. The solder joints prepared based on Zn@Sn preform achieved bonding at a lower reflow temperature with high shear strength and favorable electrical resistivity and thermal expansion coefficients.
JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T
(2022)
Article
Computer Science, Information Systems
Serguei Stoukatch, Jean-Francois Fagnard, Francois Dupont, Philippe Laurent, Marc Debliquy, Jean-Michel Redoute
Summary: The research team developed a low-cost, compact, and high-performance packaging solution for MOX gas sensors using 3D finite elements modelling. They created a low thermal conductivity xerogel-epoxy composite to thermally insulate the MOX sensor. The packaging approach has a small number of assembly steps, low cost, and keeps all thermally sensitive parts at a low temperature.
Article
Engineering, Electrical & Electronic
Yalin Wang, Yi Ding, Zhao Yuan, Hongwu Peng, Jiandong Wu, Yi Yin, Tao Han, Fang Luo
Summary: This article explores the challenges of insulation design in compact high-voltage SiC modules, introducing a new PD testing platform and analyzing PD phenomena in packaging insulation under both dc and PWM waveforms.
IEEE TRANSACTIONS ON POWER ELECTRONICS
(2021)
Article
Engineering, Electrical & Electronic
Ardalan Nasiri, Simon Ang
Summary: The research on alumina-based die-attach and encapsulation for high-temperature electronic packaging showed promising results in meeting MIL-STD-883 requirements and improving encapsulation properties compared to commercial ceramic encapsulants. The addition of nano-aluminum nitride and nanosilica powders helped enhance the curing process and increase bond shear strength. The inclusion of nanosilica also led to smaller crystallite sizes and higher microstrain, contributing to better performance of the alumina crystal structure.
JOURNAL OF ELECTRONIC PACKAGING
(2021)
Article
Physics, Multidisciplinary
Moritz Gubler, Marco Krummenacher, Jonas A. Finkler, Jose A. Flores-Livas, Stefan Goedecker
Summary: This paper presents the results of an extensive search for ternary solids containing lutetium, nitrogen, and hydrogen. A novel lutetium hydride structure is found, but it is not a candidate structure for near ambient superconductivity. The results agree closely with previous studies, suggesting the maturity of crystal structure prediction field. It is unlikely that a structure giving rise to the observed superconducting properties exists in this material.
NEW JOURNAL OF PHYSICS
(2023)
Article
Materials Science, Multidisciplinary
Haolan Gou, Ying Bao, Jiateng Huang, Xiaoma Fei, Xiaojie Li, Wei Wei
Summary: This study investigates the curing behavior, processability, and thermal performance of heat-resistant molding compounds made from polyfunctional epoxy resin and diamine-phenol benzoxazine. The compounds exhibit good processability and improved thermal and mechanical properties compared to commercial epoxy molding compounds. The research provides a promising strategy for preparing heat-resistant electronic packaging molding compounds.
MACROMOLECULAR MATERIALS AND ENGINEERING
(2022)
Article
Nanoscience & Nanotechnology
Shaojia Deng, Xin Zhang, Guowei David Xiao, Kai Zhang, Xiaowu He, Shihan Xin, Xinlu Liu, Anhui Zhong, Yang Chai
Summary: Sintered nano-copper is a promising choice for thermal interface material in high power electronics, and the addition of graphene can significantly improve its thermal conductivity. The developed TIM can be widely used in high power electronic packaging, especially for high temperature applications.
Article
Automation & Control Systems
Shengchang Lu, Tianyu Zhao, Zichen Zhang, Khai D. T. Ngo, Rolando Burgos, Guo-Quan Lu
Summary: A packaging technique for gallium-nitride power transistors was developed to address the challenges of low parasitic inductance and high heat dissipation.
IEEE TRANSACTIONS ON INDUSTRIAL ELECTRONICS
(2023)
Article
Engineering, Electrical & Electronic
Boyan Wang, Ming Xiao, Zichen Zhang, Yifan Wang, Yuan Qin, Qihao Song, Guo-Quan Lu, Khai Ngo, Yuhao Zhang
Summary: Size optimization of Achip is crucial for accurate cost analysis and design of multichip modules, especially for high-cost WBG and UWBG power devices. This study presents a new electrothermal approach to optimize Achip for a given set of specifications, considering breakdown voltage, conduction current, and switching frequency. The approach takes into account conduction and switching losses, as well as heat dissipation in the chip and package. It provides guidelines for power module design and offers more accurate cost analysis.
IEEE TRANSACTIONS ON ELECTRON DEVICES
(2023)
Article
Engineering, Electrical & Electronic
Jayesh Kumar Motwani, Boran Fan, Yu Rong, Dushan Boroyevich, Dong Dong, Rolando Burgos
Summary: Modular multilevel converters (MMCs) are popular for high/medium-voltage applications, but their adoption is limited by large capacitor requirements. A new switching-cycle-balancing control has been proposed to significantly reduce the required capacitor capacity, allowing for MMC dc-dc operation. However, the effectiveness of the capacitor voltage balancing is affected by nonideal factors, making a closed-loop balancing scheme critical. This letter tackles the challenge of closed-loop balancing control and develops an effective scheme, validated using a custom-built 10-kV SiC mosfet-based MMC under 18-kV dc-link voltage.
IEEE TRANSACTIONS ON POWER ELECTRONICS
(2023)
Review
Engineering, Electrical & Electronic
Panpan Lu, Longnv Li, Guo-Quan Lu, Zhibin Shuai, Xinhua Guo, Yun-Hui Mei
Summary: Power module packaging technologies are evolving to meet the compact high-power-density requirements. This article summarizes the thermal and electrical advantages of double-sided cooling power modules compared to wire-bonding. It also provides detailed introductions of typical double-sided cooling power modules developed by institutes or companies. The challenges and future trends of double-sided cooling power modules are highlighted.
IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY
(2023)
Article
Engineering, Electrical & Electronic
Siqi Liu, Yun-Hui Mei, Jing Li, Xin Li, Guo-Quan Lu
Summary: The use of a composite buffer layer can effectively reduce thermomechanical stress caused by the mismatch of coefficients of thermal expansion (CTE) in double-sided bidirectional modules (BMs), thereby improving the reliability of the module.
IEEE TRANSACTIONS ON POWER ELECTRONICS
(2023)
Article
Engineering, Electrical & Electronic
Giampaolo Buticchi, Pat Wheeler, Dushan Boroyevich
Summary: Aviation is a major contributor to greenhouse gas emissions, driving the need for aircraft electrification to reduce pollution and improve flight efficiency. This article provides an overview of recent advancements and trends in aircraft electrification, referencing the global aviation roadmap.
PROCEEDINGS OF THE IEEE
(2023)
Article
Engineering, Electrical & Electronic
Yu Rong, Zhiyu Shen, Jun Wang, Jianghui Yu, Boran Fan, Slavko Mocevic, Dushan Boroyevich, Rolando Burgos
Summary: This article introduces the development of a PESNet 3.0 system network with sub-nanosecond synchronization error and gigabits-per-second data rate. The White Rabbit Network technology and simplified node-to-node phase-locked loop and improved precision time protocol model are used for frequency and phase locking. Finally, the experimental validation demonstrates the PESNet 3.0's synchronization error of +/- 0.5 ns at a 5 Gb/s data rate.
IEEE JOURNAL OF EMERGING AND SELECTED TOPICS IN POWER ELECTRONICS
(2023)
Article
Engineering, Electrical & Electronic
Chao Ding, Shengchang Lu, Zichen Zhang, Kun Zhang, Tam Nguyen, Khai D. T. Ngo, Rolando Burgos, Guo-Quan Lu
Summary: Low-profile double-side cooled power modules are being used in electric-drive inverters to achieve higher power density and efficiency. The use of porous sintered-silver (Ag) interposers in these modules has been proposed to reduce thermomechanical stresses and improve heat extraction. A revised half-bridge module layout was also proposed to further reduce power-loop parasitic inductance and improve power handling capability. The modules were fabricated using high-temperature packaging materials and showed excellent power handling capability, validated through thermal and electrical testing.
IEEE TRANSACTIONS ON POWER ELECTRONICS
(2023)
Article
Engineering, Electrical & Electronic
Yuliang Cao, Boran Fan, Yijie Bai, Vladimir Mitrovic, Dong Dong, Rolando Burgos, Dushan Boroyevich
Summary: This letter presents a method to further reduce common-mode noise and achieve DC voltage auto-balance in a symmetric three-level buck-boost converter. By connecting the input and output midpoints, the noise can be trapped inside the power converter, resulting in a significant reduction in common-mode noise. Additionally, a combination of bridged midpoints and coupled buck-boost inductor allows the converter to achieve the desired DC voltage auto-balance feature.
IEEE TRANSACTIONS ON POWER ELECTRONICS
(2023)
Article
Engineering, Electrical & Electronic
Yuliang Cao, Yijie Bai, Vladimir Mitrovic, Boran Fan, Dong Dong, Rolando Burgos, Dushan Boroyevich, Radha Sree Krishna Moorthy, Madhu Chinthavali
Summary: This article proposes a symmetric three-level (3-L) buck-boost converter to suppress common-mode noise. A planar coupled inductor is designed to reduce winding loss by 30%. A simplified real-time minimum rms current calculation method is found for closed-loop output control, and a decoupled mid-points balance control is proposed. The proposed converter achieves up to 25 dB CM noise reduction from 150 kHz to 30 MHz compared to a typical FSBB converter.
IEEE TRANSACTIONS ON POWER ELECTRONICS
(2023)
Proceedings Paper
Engineering, Electrical & Electronic
Ning Yan, Keyao Sun, Boran Fan, Dong Dong, Rolando Burgos, Dushan Boroyevich
Summary: This paper highlights the significance of the auxiliary power supply system in modular medium voltage SiC-based conversion systems and presents a system consisting of five individual converters to meet the requirements of high insulation capability, low common-mode coupling capacitance, high reliability, and a simple structure with a small converter size.
2023 IEEE APPLIED POWER ELECTRONICS CONFERENCE AND EXPOSITION, APEC
(2023)
Proceedings Paper
Engineering, Electrical & Electronic
Xiang Lin, David Nam, Ning Yan, Joshua Stewart, Arthur Mendes, Dong Dong, Rolando Burgos, Dushan Boroyevich
Summary: This paper presents a 13.8 kV / 1.1MVA 3-phase 5-level flying capacitor converter design with emerging 10 kV SiC MOSFET for medium voltage applications. The paper focuses on the selection method of the flying capacitor values and presents the design of different components including the converter layout arrangement, gate driver design, and auxiliary power system design. The testing of different components and the result of the phase leg are also shown in this paper.
2023 IEEE APPLIED POWER ELECTRONICS CONFERENCE AND EXPOSITION, APEC
(2023)
Proceedings Paper
Engineering, Electrical & Electronic
Yijie Bai, Yuliang Cao, Vladimir Mitrovic, Boran Fan, Rolando Burgos, Dushan Boroyevich
Summary: With the development of energy storage systems, the FSBB converter, which allows for bi-directional power flow and wide voltage conversion capabilities, has gained popularity. The existing QCM approaches for FSBB have hindered its wide adoption due to complexity. To address this, a simplified four-quadrangle modulation was found, which eliminates the need for look-up tables or extra current detection. A small signal model was also proposed to aid compensator design. The proposed control scheme and small-signal model were verified through the implementation of a SiC-based 50kW FSBB converter.
2023 IEEE APPLIED POWER ELECTRONICS CONFERENCE AND EXPOSITION, APEC
(2023)
Article
Energy & Fuels
Chen-Ching Liu, Akshay Kumar Jain, Dushan Boroyevich, Igor Cvetkovic, Nitasha Sahani, Lung-An Lee, Jennifer Appiah-Kubi, Kevin P. P. Schneider, Francis K. K. Tuffner, Dan Ton
Summary: For power grids with high penetration of distributed energy resources (DERs), microgrids can provide operation and control capabilities for clusters of DERs and load. Furthermore, microgrids enhance resilience of the hosting bulk power grid if they are enabled to serve critical load beyond the jurisdiction of the microgrids.
IEEE OPEN ACCESS JOURNAL OF POWER AND ENERGY
(2023)
Proceedings Paper
Energy & Fuels
Vladimir Mitrovic, Igor Cvetkovic, Dushan Boroyevich, Joseph Wheeler, Robert Vance
Summary: Technology advancements in the past two decades have significantly transformed the way people live, interact, and work, more so than any previous technology in the last 100 years. Virginia Tech's FutureHAUS, which won first place in an international competition, demonstrates the use of advanced manufacturing concepts, prefabricated structures, and power electronics to revolutionize modern home design. This paper describes the implementation of an electronic energy system and an energy management algorithm to achieve a net-positive energy balance in the FutureHAUS.
2023 IEEE CONFERENCE ON POWER ELECTRONICS AND RENEWABLE ENERGY, CPERE
(2023)
