Effect of electromigration on intermetallic compound formation in line-type Cu/Sn/Cu interconnect

Published 2010 View Full Article

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Title
Effect of electromigration on intermetallic compound formation in line-type Cu/Sn/Cu interconnect
Authors
Keywords
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Journal
JOURNAL OF ALLOYS AND COMPOUNDS
Volume 504, Issue 2, Pages 535-541
Publisher
Elsevier BV
Online
2010-06-12
DOI
10.1016/j.jallcom.2010.05.158

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