Miniaturization Strategy for Directional Couplers Based on Through-Silicon Via Insertion and Neuro-Transfer Function Modeling Method

Systematic Order Fitting Algorithm in Neuro-TF for Parametric Modeling of Microwave Components

(2022) Yan Zhuo et al.   IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS

A Ku-Band Eight-Element Phased-Array Transmitter With Built-in Self-Test Capability in 180-nm CMOS Technology

(2022) Yiming Yu et al.   IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS

A Simplified Vector-Sum Phase Shifter Topology With Low Noise Figure and High Voltage Gain

(2022) Feng Qiu et al.   IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS

Machine Learning for Automating the Design of Millimeter-Wave Baluns

(2021) Huy Thong Nguyen et al.   IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS I-REGULAR PAPERS

ANNs for Fast Parameterized EM Modeling: The State of the Art in Machine Learning for Design Automation of Passive Microwave Structures

(2021) Feng Feng et al.   IEEE MICROWAVE MAGAZINE

Machine Learning for Automating Millimeter-Wave Directional Coupler Designs

(2021) Huy Thong Nguyen et al.   IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS II-EXPRESS BRIEFS

Knowledge-Based Neural Networks for Fast Design Space Exploration of Hybrid Copper-Graphene On-Chip Interconnect Networks

(2021) Rahul Kumar et al.   IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY

A miniature TSV-based branch line coupler using π equivalent circuit model for transmission line

(2021) Fengjuan Wang et al.   IEICE Electronics Express

Refractive Index Sensing Free From Critical Wavelength Referencing Using Fiber-Optic Directional Coupler

(2021) Garima Bawa et al.   JOURNAL OF LIGHTWAVE TECHNOLOGY

Ultrawideband Signal Transition Using Quasi-Coaxial Through-Silicon-Via (TSV) for mm-Wave IC Packaging

(2020) Jong-Min Yook et al.   IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS

A Millimeter-Wave Reconfigurable On-Chip Coupler With Tunable Power-Dividing Ratios in 0.13-$\mu$ m BiCMOS Technology

(2020) Yang Yang et al.   IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS I-REGULAR PAPERS

Single-Inductor–Multiple-Tier Regulation: TSV-Inductor-Based On-Chip Buck Converters for 3-D IC Power Delivery

(2019) Umamaheswara Rao Tida et al.   IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS

3-D Compact 3-dB Branch-Line Directional Couplers Based on Through-Silicon Via Technology for Millimeter-Wave Applications

(2019) Qijun Lu et al.   IEEE Transactions on Components Packaging and Manufacturing Technology

Ultrasensitive label-free optical microfiber coupler biosensor for detection of cardiac troponin I based on interference turning point effect

(2018) Wenchao Zhou et al.   BIOSENSORS & BIOELECTRONICS

A Digitally Controlled Fully Integrated Voltage Regulator With 3-D-TSV-Based On-Die Solenoid Inductor With a Planar Magnetic Core for 3-D-Stacked Die Applications in 14-nm Tri-Gate CMOS

(2018) Harish K. Krishnamurthy et al.   IEEE JOURNAL OF SOLID-STATE CIRCUITS

High-Efficiency Broadband Rectifier With Wide Ranges of Input Power and Output Load Based on Branch-Line Coupler

(2017) Xiu Yin Zhang et al.   IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS I-REGULAR PAPERS

Physical Models of Planar Spiral Inductor Integrated on the High-Resistivity and Trap-Rich Silicon-on-Insulator Substrates

(2017) Shuangke Liu et al.   IEEE TRANSACTIONS ON ELECTRON DEVICES

Modeling and Crosstalk Evaluation of 3-D TSV-Based Inductor With Ground TSV Shielding

(2017) Saikat Mondal et al.   IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS

Bandpass Filtering Doherty Power Amplifier With Enhanced Efficiency and Wideband Harmonic Suppression

(2016) Shao Yong Zheng et al.   IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS I-REGULAR PAPERS

Electrical Characterization of Coaxial Silicon–Insulator–Silicon Through-Silicon Vias: Theoretical Analysis and Experiments

(2016) Zhiming Chen et al.   IEEE TRANSACTIONS ON ELECTRON DEVICES

Parametric Modeling of EM Behavior of Microwave Components Using Combined Neural Networks and Pole-Residue-Based Transfer Functions

(2016) Feng Feng et al.   IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES

Knowledge-Based Neural Network Model for FPGA Logical Architecture Development

(2016) Qiang Liu et al.   IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS

Built-In Self-Test and Digital Calibration of Zero-IF RF Transceivers

(2016) Jae Woong Jeong et al.   IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS

Device Characteristics of TSV-Based Piezoelectric Resonator With Load Capacitance and Static Capacitance Modification

(2015) Jian-Yu Shih et al.   IEEE TRANSACTIONS ON ELECTRON DEVICES

On the Efficacy of Through-Silicon-Via Inductors

(2015) Umamaheswara Rao Tida et al.   IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS

Automated Knowledge-Based Neural Network Modeling for Microwave Applications

(2014) Wei Cong Na et al.   IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS

A 10/24-GHz CMOS/IPD Monopulse Receiver for Angle-Discrimination Radars

(2014) Sen Wang et al.   IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS I-REGULAR PAPERS

Silicon Effect-Aware Full-Chip Extraction and Mitigation of TSV-to-TSV Coupling

(2014) Yarui Peng et al.   IEEE TRANSACTIONS ON COMPUTER-AIDED DESIGN OF INTEGRATED CIRCUITS AND SYSTEMS

Multisection Couplers With Coupled-Line Sections Having Unequal Lengths

(2014) Kamil Staszek et al.   IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES

Wideband Impedance Model for Coaxial Through-Silicon Vias in 3-D Integration

(2013) Feng Liang et al.   IEEE TRANSACTIONS ON ELECTRON DEVICES

Modeling of Crosstalk in Through Silicon Vias

(2012) A. Ege Engin et al.   IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY

A High Frequency Equivalent Circuit and Parameter Extraction Procedure for Common Mode Choke in the EMI Filter

(2012) Wenhua Tan et al.   IEEE TRANSACTIONS ON POWER ELECTRONICS

Closed-Form Expressions for the Resistance and the Inductance of Different Profiles of Through-Silicon Vias

(2011) Yuanjun Liang et al.   IEEE ELECTRON DEVICE LETTERS

Directional Coupler Compensation With Optimally Positioned Capacitances

(2011) Johannes Muller et al.   IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES

TSV Redundancy: Architecture and Design Issues in 3-D IC

(2011) Ang-Chih Hsieh et al.   IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS

Fast and Accurate Analytical Modeling of Through-Silicon-Via Capacitive Coupling

(2011) Dae Hyun Kim et al.   IEEE Transactions on Components Packaging and Manufacturing Technology

High-Frequency Modeling of TSVs for 3-D Chip Integration and Silicon Interposers Considering Skin-Effect, Dielectric Quasi-TEM and Slow-Wave Modes

(2011) Ivan Ndip et al.   IEEE Transactions on Components Packaging and Manufacturing Technology

High-Frequency Scalable Electrical Model and Analysis of a Through Silicon Via (TSV)

(2011) Joohee Kim et al.   IEEE Transactions on Components Packaging and Manufacturing Technology

A Reconfigurable Carrier Leakage Canceler for UHF RFID Reader Front-Ends

(2010) Sung-Chan Jung et al.   IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS I-REGULAR PAPERS

Compact AC Modeling and Performance Analysis of Through-Silicon Vias in 3-D ICs

(2010) Chuan Xu et al.   IEEE TRANSACTIONS ON ELECTRON DEVICES

Power Delivery Design for 3-D ICs Using Different Through-Silicon Via (TSV) Technologies

(2010) Nauman H. Khan et al.   IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS

Closed-Form Equations of Conventional Microstrip Couplers Applied to Design Couplers and Filters Constructed With Floating-Plate Overlay

(2008) Kuo-Sheng Chin et al.   IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES