Modeling of Crosstalk in Through Silicon Vias

Closed-Form Expressions for the Resistance and the Inductance of Different Profiles of Through-Silicon Vias

(2011) Yuanjun Liang et al.   IEEE ELECTRON DEVICE LETTERS

Compact Modeling and Analysis of Through-Si-Via-Induced Electrical Noise Coupling in Three-Dimensional ICs

(2011) Chuan Xu et al.   IEEE TRANSACTIONS ON ELECTRON DEVICES

Compact Wideband Equivalent-Circuit Model for Electrical Modeling of Through-Silicon Via

(2011) En-Xiao Liu et al.   IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES

Electromagnetic modeling of massively coupled through silicon vias for 3D interconnects

(2011) Boping Wu et al.   MICROWAVE AND OPTICAL TECHNOLOGY LETTERS

Design and Modeling Methodology of Vertical Interconnects for 3DI Applications

(2011) R Gordin et al.   IEEE Transactions on Components Packaging and Manufacturing Technology

Fast and Accurate Analytical Modeling of Through-Silicon-Via Capacitive Coupling

(2011) Dae Hyun Kim et al.   IEEE Transactions on Components Packaging and Manufacturing Technology

High-Speed Design and Broadband Modeling of Through-Strata-Vias (TSVs) in 3D Integration

(2011) Zheng Xu et al.   IEEE Transactions on Components Packaging and Manufacturing Technology

PDN Impedance Modeling and Analysis of 3D TSV IC by Using Proposed P/G TSV Array Model Based on Separated P/G TSV and Chip-PDN Models

(2011) Jun So Pak et al.   IEEE Transactions on Components Packaging and Manufacturing Technology

High-Frequency Scalable Electrical Model and Analysis of a Through Silicon Via (TSV)

(2011) Joohee Kim et al.   IEEE Transactions on Components Packaging and Manufacturing Technology

Through-Silicon-Via Capacitance Reduction Technique to Benefit 3-D IC Performance

(2010) Guruprasad Katti et al.   IEEE ELECTRON DEVICE LETTERS

Design Issues and Considerations for Low-Cost 3-D TSV IC Technology

(2010) Geert Van der Plas et al.   IEEE JOURNAL OF SOLID-STATE CIRCUITS

RF Characterization and Analytical Modelling of Through Silicon Vias and Coplanar Waveguides for 3D Integration

(2010) Y P R Lamy et al.   IEEE TRANSACTIONS ON ADVANCED PACKAGING

Compact AC Modeling and Performance Analysis of Through-Silicon Vias in 3-D ICs

(2010) Chuan Xu et al.   IEEE TRANSACTIONS ON ELECTRON DEVICES

Space-Charge Plane-Wave Interaction at Semiconductor Substrate Boundary

(2010) Ibrahim A. Elabyad et al.   IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES

Prediction and Comparison of High-Performance On-Chip Global Interconnection

(2010) Yulei Zhang et al.   IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS

Power Delivery Design for 3-D ICs Using Different Through-Silicon Via (TSV) Technologies

(2010) Nauman H. Khan et al.   IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS

Electrical Characterization for Intertier Connections and Timing Analysis for 3-D ICs

(2010) Xiaoxia Wu et al.   IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS

TSV Technology for Millimeter-Wave and Terahertz Design and Applications

(2010) Sanming Hu et al.   IEEE Transactions on Components Packaging and Manufacturing Technology

On Simplified Fast Modal Analysis for Through Silicon Vias in Layered Media Based Upon Full-Wave Solutions

(2009) Zhonghai Guo et al.   IEEE TRANSACTIONS ON ADVANCED PACKAGING

Closed-Form Expressions of 3-D Via Resistance, Inductance, and Capacitance

(2009) Ioannis Savidis et al.   IEEE TRANSACTIONS ON ELECTRON DEVICES

Electrical Modeling and Characterization of Through Silicon via for Three-Dimensional ICs

(2009) Guruprasad Katti et al.   IEEE TRANSACTIONS ON ELECTRON DEVICES

Through-Silicon Via (TSV)

(2009) Makoto Motoyoshi   PROCEEDINGS OF THE IEEE