3-D Compact 3-dB Branch-Line Directional Couplers Based on Through-Silicon Via Technology for Millimeter-Wave Applications

Published 2019 View Full Article

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Title
3-D Compact 3-dB Branch-Line Directional Couplers Based on Through-Silicon Via Technology for Millimeter-Wave Applications
Authors
Keywords
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Journal
IEEE Transactions on Components Packaging and Manufacturing Technology
Volume 9, Issue 9, Pages 1855-1862
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Online
2019-07-10
DOI
10.1109/tcpmt.2019.2927553

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