Modeling and Crosstalk Evaluation of 3-D TSV-Based Inductor With Ground TSV Shielding

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Title
Modeling and Crosstalk Evaluation of 3-D TSV-Based Inductor With Ground TSV Shielding
Authors
Keywords
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Journal
IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS
Volume 25, Issue 1, Pages 308-318
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Online
2016-05-28
DOI
10.1109/tvlsi.2016.2568755

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