A miniature TSV-based branch line coupler using π equivalent circuit model for transmission line

TSV-based hairpin bandpass filter for 6G mobile communication applications

(2021) Fengjuan Wang et al.   IEICE Electronics Express

Analytical models of AC inductance and quality factor for TSV-based inductor

(2021) Xiangkun Yin et al.   IEICE Electronics Express

Miniaturized SIW Bandpass Filter Based on TSV Technology for THz Applications

(2020) Fengjuan Wang et al.   IEEE Transactions on Terahertz Science and Technology

Through-Silicon Via-Based Capacitor and Its Application in LDO Regulator Design

(2019) Libo Qian et al.   IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS

3-D Compact 3-dB Branch-Line Directional Couplers Based on Through-Silicon Via Technology for Millimeter-Wave Applications

(2019) Qijun Lu et al.   IEEE Transactions on Components Packaging and Manufacturing Technology

A novel guard method of through-silicon-via (TSV)

(2018) Fengjuan Wang et al.   IEICE Electronics Express

Fabrication and measurement of 3D LPF based on coaxial TSV

(2018) Fengjuan Wang et al.   ELECTRONICS LETTERS

Wideband Substrate Integrated Waveguide Bandpass Filter Based on 3-D ICs

(2018) Xiaoxian Liu et al.   IEEE Transactions on Components Packaging and Manufacturing Technology

An Ultracompact Butterworth Low-Pass Filter Based on Coaxial Through-Silicon Vias

(2017) Fengjuan Wang et al.   IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS

High-Frequency Electrical Model of Through-Silicon Vias for 3-D Integrated Circuits Considering Eddy Current and Proximity Effects

(2017) Qijun Lu et al.   IEEE Transactions on Components Packaging and Manufacturing Technology

Simple and accurate inductance model of 3D inductor based on TSV

(2016) Fengjuan Wang et al.   ELECTRONICS LETTERS

New coaxial through silicon via (TSV) applied for three dimensional integrated circuits (3D ICs)

(2016) Yintang Yang et al.   IEICE Electronics Express

Thermal-Aware High-Frequency Characterization of Large-Scale Through-Silicon-Via Structures

(2014) Tianjian Lu et al.   IEEE Transactions on Components Packaging and Manufacturing Technology

New Wideband Miniature Branchline Coupler on IPD Technology for Beamforming Applications

(2014) Diane Titz et al.   IEEE Transactions on Components Packaging and Manufacturing Technology

Miniature Butler Matrix Design Using Glass-Based Thin-Film Integrated Passive Device Technology for 2.5-GHz Applications

(2013) Yo-Shen Lin et al.   IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES

RF Characterization and Analytical Modelling of Through Silicon Vias and Coplanar Waveguides for 3D Integration

(2010) Y P R Lamy et al.   IEEE TRANSACTIONS ON ADVANCED PACKAGING