Single-Inductor–Multiple-Tier Regulation: TSV-Inductor-Based On-Chip Buck Converters for 3-D IC Power Delivery

Published 2019 View Full Article

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Title
Single-Inductor–Multiple-Tier Regulation: TSV-Inductor-Based On-Chip Buck Converters for 3-D IC Power Delivery
Authors
Keywords
-
Journal
IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS
Volume 27, Issue 10, Pages 2305-2316
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Online
2019-06-27
DOI
10.1109/tvlsi.2019.2919606

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