Ultrawideband Signal Transition Using Quasi-Coaxial Through-Silicon-Via (TSV) for mm-Wave IC Packaging

Published 2020 View Full Article

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Journal

IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS

Volume 30, Issue 2, Pages 167-169

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Online

2020-01-08

DOI

10.1109/lmwc.2019.2960884

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IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS

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