Electrical resistivity evolution in electrodeposited Ru and Ru-Co nanowires

The search for the most conductive metal for narrow interconnect lines

(2020) Daniel Gall   JOURNAL OF APPLIED PHYSICS

Electroplated Ru and RuCo films as a copper diffusion barrier

(2020) Kuan Chen Wu et al.   APPLIED SURFACE SCIENCE

Grain size-dependent Mg/Si ratio effect on the microstructure and mechanical/electrical properties of Al-Mg-Si-Sc alloys

(2019) Shengyu Jiang et al.   JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY

Miniaturization of CMOS

(2019) Henry H. Radamson et al.   Micromachines

Electron scattering at interfaces in nano-scale vertical interconnects: A combined experimental and ab initio study

(2018) Nicholas A. Lanzillo et al.   APPLIED PHYSICS LETTERS

Finite Size Effects in Highly Scaled Ruthenium Interconnects

(2018) Shibesh Dutta et al.   IEEE ELECTRON DEVICE LETTERS

On-Chip Interconnect Conductor Materials for End-of-Roadmap Technology Nodes

(2018) Anshul A. Vyas et al.   IEEE TRANSACTIONS ON NANOTECHNOLOGY

Defect and grain boundary scattering in tungsten: A combined theoretical and experimental study

(2018) Nicholas A. Lanzillo et al.   JOURNAL OF APPLIED PHYSICS

Resistivity size effect in epitaxial Ru(0001) layers

(2018) Erik Milosevic et al.   JOURNAL OF APPLIED PHYSICS

Highly Scaled Ruthenium Interconnects

(2017) Shibesh Dutta et al.   IEEE ELECTRON DEVICE LETTERS

Thickness dependence of the resistivity of platinum-group metal thin films

(2017) Shibesh Dutta et al.   JOURNAL OF APPLIED PHYSICS

Electron mean free path in elemental metals

(2016) Daniel Gall   JOURNAL OF APPLIED PHYSICS

A study on the plating and wetting ability of ruthenium-tungsten multi-layers for advanced Cu metallization

(2016) Tai-Chen Kuo et al.   MICROELECTRONIC ENGINEERING

The Mechanism of Schottky Barrier Modulation of Tantalum Nitride/Ge Contacts

(2015) Yujin Seo et al.   IEEE ELECTRON DEVICE LETTERS

Cobalt advanced barrier metallization: A resistivity composition analysis

(2015) M. Wislicenus et al.   MICROELECTRONIC ENGINEERING

A Proposal for a Novel Hybrid Interconnect Technology for the End of Roadmap

(2014) Chenyun Pan et al.   IEEE ELECTRON DEVICE LETTERS

Electron scattering mechanisms in Cu-Mn films for interconnect applications

(2014) F. Misják et al.   JOURNAL OF APPLIED PHYSICS

Different Diffusion Behavior of Cu and Ni Undergoing Liquid–solid Electromigration

(2014) M.L. Huang et al.   JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY

The electron scattering at grain boundaries in tungsten films

(2014) Dooho Choi   MICROELECTRONIC ENGINEERING

Electromigration challenges for advanced on-chip Cu interconnects

(2014) Baozhen Li et al.   MICROELECTRONICS RELIABILITY

Electron mean free path model for rectangular nanowire, nanofilm and nanoparticle

(2014) Congliang Huang et al.   PHYSICA B-CONDENSED MATTER

Advanced Interconnects: Materials, Processing, and Reliability

(2014) Mikhail R. Baklanov et al.   ECS Journal of Solid State Science and Technology

Ultrathin Cr added Ru film as a seedless Cu diffusion barrier for advanced Cu interconnects

(2012) Kuo-Chung Hsu et al.   APPLIED SURFACE SCIENCE

Low-Resistivity 10 nm Diameter Magnetic Sensors

(2012) Mazin M. Maqableh et al.   NANO LETTERS

Ohm's Law Survives to the Atomic Scale

(2012) B. Weber et al.   SCIENCE

Diffusion barrier performance of TiVCr alloy film in Cu metallization

(2011) Du-Cheng Tsai et al.   APPLIED SURFACE SCIENCE

Robust ultra-thin RuMo alloy film as a seedless Cu diffusion barrier

(2011) Kuo-Chung Hsu et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Electron scattering at surfaces and grain boundaries in Cu thin films and wires

(2011) J. S. Chawla et al.   PHYSICAL REVIEW B

Characteristics of a 10nm-thick (TiVCr)N multi-component diffusion barrier layer with high diffusion resistance for Cu interconnects

(2011) Du-Cheng Tsai et al.   SURFACE & COATINGS TECHNOLOGY

Near-Bulk Conductivity of Gold Nanowires as Nanoscale Interconnects and the Role of Atomically Smooth Interface

(2010) Kevin Critchley et al.   ADVANCED MATERIALS

Resistivity dominated by surface scattering in sub-50 nm Cu wires

(2010) R. L. Graham et al.   APPLIED PHYSICS LETTERS