Ultrathin Cr added Ru film as a seedless Cu diffusion barrier for advanced Cu interconnects

Title
Ultrathin Cr added Ru film as a seedless Cu diffusion barrier for advanced Cu interconnects
Authors
Keywords
-
Journal
APPLIED SURFACE SCIENCE
Volume 258, Issue 18, Pages 7225-7230
Publisher
Elsevier BV
Online
2012-04-16
DOI
10.1016/j.apsusc.2012.04.046

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