A Proposal for a Novel Hybrid Interconnect Technology for the End of Roadmap

Title
A Proposal for a Novel Hybrid Interconnect Technology for the End of Roadmap
Authors
Keywords
-
Journal
IEEE ELECTRON DEVICE LETTERS
Volume 35, Issue 2, Pages 250-252
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Online
2014-02-01
DOI
10.1109/led.2013.2291783

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