Defect and grain boundary scattering in tungsten: A combined theoretical and experimental study

First-Principles Investigations of TiGe/Ge Interface and Recipes to Reduce the Contact Resistance

(2017) Hemant Dixit et al.   IEEE TRANSACTIONS ON ELECTRON DEVICES

Electronic and structural analysis of ultra-small-diameter metal disilicide nanowires

(2017) Nicholas A. Lanzillo et al.   JOURNAL OF APPLIED PHYSICS

Ab Initio evaluation of electron transport properties of Pt, Rh, Ir, and Pd nanowires for advanced interconnect applications

(2017) Nicholas A. Lanzillo   JOURNAL OF APPLIED PHYSICS

Electron mean free path in elemental metals

(2016) Daniel Gall   JOURNAL OF APPLIED PHYSICS

Reducing Grain-Boundary Resistivity of Copper Nanowires by Doping

(2016) Mathieu César et al.   Physical Review Applied

Weak electron–phonon coupling in the early alkali atomic wires

(2015) Nicholas A. Lanzillo et al.   PHYSICA E-LOW-DIMENSIONAL SYSTEMS & NANOSTRUCTURES

Electron transport properties of sub-3-nm diameter copper nanowires

(2015) Sarah L. T. Jones et al.   PHYSICAL REVIEW B

On the feasibility of ab initio electronic structure calculations for Cu using a single s orbital basis

(2015) Ganesh Hegde et al.   AIP Advances

Failure of semiclassical models to describe resistivity of nanometric, polycrystalline tungsten films

(2014) Dooho Choi et al.   JOURNAL OF APPLIED PHYSICS

The electron scattering at grain boundaries in tungsten films

(2014) Dooho Choi   MICROELECTRONIC ENGINEERING

Pressure-enabled phonon engineering in metals

(2014) N. A. Lanzillo et al.   PROCEEDINGS OF THE NATIONAL ACADEMY OF SCIENCES OF THE UNITED STATES OF AMERICA

Exploring Alternative Metals to Cu and W for Interconnects Applications Using Automated First-Principles Simulations

(2014) K. Sankaran et al.   ECS Journal of Solid State Science and Technology

Calculated Resistances of Single Grain Boundaries in Copper

(2014) Mathieu César et al.   Physical Review Applied

Aluminum Conducts Better than Copper at the Atomic Scale: A First-Principles Study of Metallic Atomic Wires

(2012) Adam J. Simbeck et al.   ACS Nano

A comparative study of quantum transport properties of silver and copper nanowires using first principles calculations

(2011) Neerav Kharche et al.   JOURNAL OF PHYSICS-CONDENSED MATTER

Electron Scattering and Electrical Conductance in Polycrystalline Metallic Films and Wires: Impact of Grain Boundary Scattering Related to Melting Point

(2010) Y. F. Zhu et al.   ACS Nano

Large Discrete Resistance Jump at Grain Boundary in Copper Nanowire

(2010) Tae-Hwan Kim et al.   NANO LETTERS

Simulation of grain boundary effects on electronic transport in metals, and detailed causes of scattering

(2010) Baruch Feldman et al.   PHYSICA STATUS SOLIDI B-BASIC SOLID STATE PHYSICS

An ab initio investigation on boundary resistance for metallic grains

(2010) Ben-hu Zhou et al.   SOLID STATE COMMUNICATIONS

Size-Dependent Resistivity in Nanoscale Interconnects

(2009) Daniel Josell et al.   Annual Review of Materials Research

Effect of nanoparticle scattering on thermoelectric power factor

(2009) Mona Zebarjadi et al.   APPLIED PHYSICS LETTERS

Resistance of copper nanowires and comparison with carbon nanotube bundles for interconnect applications using first principles calculations

(2008) Y Zhou et al.   JOURNAL OF PHYSICS-CONDENSED MATTER