Electron scattering mechanisms in Cu-Mn films for interconnect applications

Structure and phase formation in Cu–Mn alloy thin films deposited at room temperature

(2012) Zs. Czigány et al.   ACTA MATERIALIA

A study on annealing mechanisms with different manganese contents in CuMn alloy

(2012) Chia-Yang Wu et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Interface stability and microstructure of an ultrathin α-Ta/graded Ta(N)/TaN multilayer diffusion barrier

(2012) C.H. Liu et al.   MICROELECTRONIC ENGINEERING

Interdiffusion and barrier layer formation in thermally evaporated Mn/Cu heterostructures on SiO2 substrates

(2011) J. G. Lozano et al.   APPLIED PHYSICS LETTERS

Mooij rule and weak localization

(2011) V. F. Gantmakher   JETP LETTERS

Restraint of Copper Oxidation Using Barrier Restoration Technique with Cu–Mn Alloy

(2010) Masaki Haneda et al.   JAPANESE JOURNAL OF APPLIED PHYSICS

Magnetic phase diagram for CuMn

(2010) Rajiv Kumar Chouhan et al.   JOURNAL OF MAGNETISM AND MAGNETIC MATERIALS

Chemical Vapor Deposition of Mn and Mn Oxide and their Step Coverage and Diffusion Barrier Properties on Patterned Interconnect Structures

(2009) Kenji Matsumoto et al.   Applied Physics Express

Phase identification of self-forming Cu–Mn based diffusion barriers on p-SiOC:H and SiO2 dielectrics using x-ray absorption fine structure

(2009) J. M. Ablett et al.   APPLIED PHYSICS LETTERS

Resistivity reduction by external oxidation of Cu–Mn alloy films for semiconductor interconnect application

(2009) J. Iijima et al.   JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B