Record-Low Thermal Boundary Resistance between Diamond and GaN-on-SiC for Enabling Radiofrequency Device Cooling

Title
Record-Low Thermal Boundary Resistance between Diamond and GaN-on-SiC for Enabling Radiofrequency Device Cooling
Authors
Keywords
-
Journal
ACS Applied Materials & Interfaces
Volume 13, Issue 50, Pages 60553-60560
Publisher
American Chemical Society (ACS)
Online
2021-12-08
DOI
10.1021/acsami.1c13833

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