Record-Low Thermal Boundary Resistance between Diamond and GaN-on-SiC for Enabling Radiofrequency Device Cooling
出版年份 2021 全文链接
标题
Record-Low Thermal Boundary Resistance between Diamond and GaN-on-SiC for Enabling Radiofrequency Device Cooling
作者
关键词
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出版物
ACS Applied Materials & Interfaces
Volume 13, Issue 50, Pages 60553-60560
出版商
American Chemical Society (ACS)
发表日期
2021-12-08
DOI
10.1021/acsami.1c13833
参考文献
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