The effects of Ni addition on microstructure evolution and mechanical properties of solder joints undergoing solid-liquid electromigration

Published 2019 View Full Article

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Title
The effects of Ni addition on microstructure evolution and mechanical properties of solder joints undergoing solid-liquid electromigration
Authors
Keywords
-
Journal
MATERIALS LETTERS
Volume 256, Issue -, Pages 126609
Publisher
Elsevier BV
Online
2019-09-01
DOI
10.1016/j.matlet.2019.126609

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