Ball shear strength and fracture modes of lead-free solder joints prepared using nickel nanoparticle doped flux
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Title
Ball shear strength and fracture modes of lead-free solder joints prepared using nickel nanoparticle doped flux
Authors
Keywords
Lead-free solder, nanoparticle doped flux, intermetallic compounds, ball shear test, fractography
Journal
Electronic Materials Letters
Volume 11, Issue 3, Pages 452-456
Publisher
Springer Nature
Online
2015-05-28
DOI
10.1007/s13391-015-4377-6
References
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