Geometrical Effects of Cu@Ag Core–Shell Nanoparticles Treated Flux on the Growth Behaviour of Intermetallics in Sn/Cu Solder Joints

Synthesis of Cu@Ag core–shell nanoparticles for characterization of thermal stability and electric resistivity

(2018) Shengyan Shang et al.   APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING

Roles of interfacial heat transfer and relative solder height on segregated growth behavior of intermetallic compounds in Sn/Cu joints during furnace cooling

(2018) Anil Kunwar et al.   INTERMETALLICS

Intermetallic compounds in 3D integrated circuits technology: a brief review

(2017) Syahira Annuar et al.   SCIENCE AND TECHNOLOGY OF ADVANCED MATERIALS

Effect of Joule heating and current crowding on electromigration in mobile technology

(2017) K. N. Tu et al.   Applied Physics Reviews

Hexagonal-Rod Growth Mechanism and Kinetics of the Primary Cu6Sn5 Phase in Liquid Sn-Based Solder

(2016) Z. H. Zhang et al.   JOURNAL OF ELECTRONIC MATERIALS

On the increase of intermetallic compound's thickness at the cold side in liquid Sn and SnAg solders under thermal gradient

(2016) Anil Kunwar et al.   MATERIALS LETTERS

The implementation of an algorithm to calculate thermodynamic equilibria for multi-component systems with non-ideal phases in a free software

(2015) Bo Sundman et al.   COMPUTATIONAL MATERIALS SCIENCE

Effect of silver (Ag) nanoparticle size on the microstructure and mechanical properties of Sn58Bi–Ag composite solders

(2015) Yi Li et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Evaluation of solder/substrate thermal conductance and wetting angle of Sn–0.7wt%Cu–(0–0.1wt%Ni) solder alloys

(2015) Bismarck Luiz Silva et al.   MATERIALS LETTERS

In-situ alloying of Sn–3.5Ag solder during reflow through Zn nanoparticle addition and its effects on interfacial intermetallic layers

(2014) A.S.M.A. Haseeb et al.   INTERMETALLICS

1D Copper Nanostructures: Progress, Challenges and Opportunities

(2014) Sushrut Bhanushali et al.   Small

Screw Dislocation Driven Growth of Nanomaterials

(2013) Fei Meng et al.   ACCOUNTS OF CHEMICAL RESEARCH

Physicochemical Properties of Sb, Sn, Zn, and Sb–Sn System

(2013) Tomasz Gancarz et al.   INTERNATIONAL JOURNAL OF THERMOPHYSICS

Effects of reflow on the interfacial characteristics between Zn nanoparticles containing Sn‐3.8Ag‐0.7Cu solder and copper substrate

(2013) Y.H. Chan et al.   SOLDERING & SURFACE MOUNT TECHNOLOGY

Influence of Ni nanoparticle on the morphology and growth of interfacial intermetallic compounds between Sn–3.8Ag–0.7Cu lead-free solder and copper substrate

(2012) S.L. Tay et al.   INTERMETALLICS

Determination of thermal conductivities of solid and liquid phases for rich-Sn compositions of Sn-Mg alloy

(2012) Fatma Meydaneri et al.   METALS AND MATERIALS INTERNATIONAL

A Comparison of Surface Tension, Viscosity, and Density of Sn and Sn–Ag Alloys Using Different Measurement Techniques

(2011) Tomasz Gancarz et al.   INTERNATIONAL JOURNAL OF THERMOPHYSICS

Inhibition of molten droplet deposition by substrate surface hydroxides

(2011) A.T.T. Tran et al.   SURFACE & COATINGS TECHNOLOGY

Influence of substrate surface conditions on the deposition and spreading of molten droplets

(2010) A.T.T. Tran et al.   THIN SOLID FILMS

The effects of solder volume and Cu concentration on the consumption rate of Cu pad during reflow soldering

(2009) C.C. Chang et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Interfacial heat transfer coefficients and solidification of an aluminum alloy in a rotary continuous caster

(2008) Noé Cheung et al.   INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER

Effect of metal/ceramic nanoparticle-doped fluxes on the wettability between Sn–Ag–Cu solder and a Cu layer

(2008) J. Shen et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Modeling the diffusion of solid copper into liquid solder alloys

(2008) M.J. Rizvi et al.   THIN SOLID FILMS