Microstructural variation and high-speed impact responses of Sn–3.0Ag–0.5Cu/ENEPIG solder joints with ultra-thin Ni–P deposit

Growth mechanisms of interfacial intermetallic compounds in Sn/Cu–Zn solder joints during aging

(2012) Chi-Yang Yu et al.   JOURNAL OF MATERIALS SCIENCE

Interfacial reactions between Sn–57Bi–1Ag solder and electroless Ni-P/immersion Au under solid-state aging

(2012) Christopher Fuchs et al.   JOURNAL OF MATERIALS SCIENCE

Suppressing the growth of interfacial Cu–Sn intermetallic compounds in the Sn–3.0Ag–0.5Cu–0.1Ni/Cu–15Zn solder joint during thermal aging

(2012) Wei-Yu Chen et al.   JOURNAL OF MATERIALS SCIENCE

Wetting kinetics and wettability enhancement of Pd added electrolytic Ni surface with molten Sn–3.0Ag–0.5Cu solder

(2012) Cheng-Ying Ho et al.   MATERIALS LETTERS

Improved strength of boron-doped Sn-1.0Ag-0.5Cu solder joints under aging conditions

(2011) Hyelim Choi et al.   INTERMETALLICS

Comparative Study of ENIG and ENEPIG as Surface Finishes for a Sn-Ag-Cu Solder Joint

(2011) Jeong-Won Yoon et al.   JOURNAL OF ELECTRONIC MATERIALS

Suppressing Ni3Sn4 formation in the Sn–Ag–Cu solder joints with Ni–P/Pd/Au surface finish

(2011) Chien-Fu Tseng et al.   MATERIALS LETTERS

Interfacial reaction and elemental redistribution in Sn3.0Ag0.5Cu–xPd/immersion Au/electroless Ni solder joints after aging

(2011) I-Tai Wang et al.   Materials Science and Engineering B-Advanced Functional Solid-State Materials

Interfacial reaction between Sn–3.0Ag–0.5Cu liquid solder and Ni–xZn novel UBM layers

(2011) Hsiu-Min Lin et al.   SURFACE & COATINGS TECHNOLOGY

Influence of Palladium Thickness on the Soldering Reactions Between Sn-3Ag-0.5Cu and Au/Pd(P)/Ni(P) Surface Finish

(2010) W. H. Wu et al.   JOURNAL OF ELECTRONIC MATERIALS

Impact Testing of Sn-3.0Ag-0.5Cu Solder with Ti/Ni(V)/Cu Under Bump Metallization After Aging at 150°C

(2010) Kai-Jheng Wang et al.   JOURNAL OF ELECTRONIC MATERIALS

Dependence of Electrical Resistivity on Temperature and Sn Content in Pb-Sn Solders

(2010) E. ÇadIrlI et al.   JOURNAL OF ELECTRONIC MATERIALS

Strong effect of Pd concentration on the soldering reaction between Ni and Sn–Pd alloys

(2010) Cheng En Ho et al.   JOURNAL OF MATERIALS RESEARCH

Crystallization Behaviour of Electroless Ni-P UBM with Medium Phosphorous Induced by Single and Step Heat Treatment

(2010) Han-Byul Kang et al.   MATERIALS TRANSACTIONS

Detailed Phase Evolution of a Phosphorous-Rich Layer and Formation of the Ni-Sn-P Compound in Sn-Ag-Cu/Electroplated Ni-P Solder Joints

(2009) Yung-Chi Lin et al.   JOURNAL OF ELECTRONIC MATERIALS

Surface Finish Effects on High-Speed Signal Degradation

(2008) Xin Wu et al.   IEEE TRANSACTIONS ON ADVANCED PACKAGING