Influences of Mono-Ni(P) and Dual-Cu/Ni(P) Plating on the Interfacial Microstructure Evolution of Solder Joints
出版年份 2018 全文链接
标题
Influences of Mono-Ni(P) and Dual-Cu/Ni(P) Plating on the Interfacial Microstructure Evolution of Solder Joints
作者
关键词
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出版物
METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE
Volume 50, Issue 1, Pages 480-492
出版商
Springer Nature
发表日期
2018-10-26
DOI
10.1007/s11661-018-4983-7
参考文献
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