Influence of Palladium Thickness on the Soldering Reactions Between Sn-3Ag-0.5Cu and Au/Pd(P)/Ni(P) Surface Finish

Published 2010 View Full Article

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Title
Influence of Palladium Thickness on the Soldering Reactions Between Sn-3Ag-0.5Cu and Au/Pd(P)/Ni(P) Surface Finish
Authors
Keywords
-
Journal
JOURNAL OF ELECTRONIC MATERIALS
Volume 39, Issue 11, Pages 2387-2396
Publisher
Springer Nature
Online
2010-09-03
DOI
10.1007/s11664-010-1351-9

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