The Effects of Antimony Addition on the Microstructural, Mechanical, and Thermal Properties of Sn-3.0Ag-0.5Cu Solder Alloy

Influence of small addition of antimony (Sb) on thermal behavior, microstructural and tensile properties of Sn-9.0Zn-0.5Al Pb-free solder alloy

(2017) A.B. El Basaty et al.   MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING

The tensile impact properties of aged Sn–3Ag–0.5Cu/Cu solder joints

(2015) Van Luong Nguyen et al.   MICROELECTRONICS RELIABILITY

Tensile creep characteristics of Sn–3.5Ag–0.5Cu (SAC355) solder reinforced with nano-metric ZnO particles

(2014) A. Fawzy et al.   MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING

Microstructure, mechanical properties, and deformation behavior of Sn–1.0Ag–0.5Cu solder after Ni and Sb additions

(2012) A.A. El-Daly et al.   MATERIALS & DESIGN

Structural and elastic properties of eutectic Sn–Cu lead-free solder alloy containing small amount of Ag and In

(2011) A.A. El-Daly et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Evolution of Ag3Sn at Sn–3.0Ag–0.3Cu–0.05Cr/Cu joint interfaces during thermal aging

(2011) Fei Lin et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Microstructural evolution and tensile properties of Sn–5Sb solder alloy containing small amount of Ag and Cu

(2011) A.A. El-Daly et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Intermetallic compound growth suppression at high temperature in SAC solders with Zn addition on Cu and Ni–P substrates

(2011) H.R. Kotadia et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Interface reaction between SnAgCu/SnAgCuCe solders and Cu substrate subjected to thermal cycling and isothermal aging

(2011) Liang Zhang et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Effect of Sb addition on the tensile deformation behavior of lead-free Sn–3.5Ag solder alloy

(2011) R. Mahmudi et al.   MATERIALS & DESIGN

Effect of addition of TiO2 nanoparticles on the microstructure, microhardness and interfacial reactions of Sn3.5AgXCu solder

(2011) S.Y. Chang et al.   MATERIALS & DESIGN

Microstructure, thermal analysis and hardness of a Sn–Ag–Cu–1wt% nano-TiO2 composite solder on flexible ball grid array substrates

(2011) Asit Kumar Gain et al.   MICROELECTRONICS RELIABILITY

Effects of solidification kinetics on microstructure formation in binary Sn–Cu solder alloys

(2010) Tina Ventura et al.   ACTA MATERIALIA

Elastic properties and thermal behavior of Sn–Zn based lead-free solder alloys

(2010) A.A. El-Daly et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Revisiting mechanisms to inhibit Ag3Sn plates in Sn–Ag–Cu solders with 1wt.% Zn addition

(2010) Z.-B. Luo et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Effect of alloying elements on properties and microstructures of SnAgCu solders

(2010) Lili Gao et al.   MICROELECTRONIC ENGINEERING

Influence of indium addition on characteristics of Sn–0.3Ag–0.7Cu solder alloy

(2009) Kannachai Kanlayasiri et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Creep properties of Sn–Sb based lead-free solder alloys

(2008) A.A. El-Daly et al.   JOURNAL OF ALLOYS AND COMPOUNDS

The Shear Strength and Fracture Behavior of Sn-Ag-xSb Solder Joints with Au/Ni-P/Cu UBM

(2008) Hwa-Teng Lee et al.   JOURNAL OF ELECTRONIC MATERIALS

Alloying modification of Sn–Ag–Cu solders by manganese and titanium

(2008) Li-Wei Lin et al.   MICROELECTRONICS RELIABILITY