Comparative study between Sn37Pb and Sn3Ag0.5Cu soldering with Au/Pd/Ni(P) tri-layer structure

Title
Comparative study between Sn37Pb and Sn3Ag0.5Cu soldering with Au/Pd/Ni(P) tri-layer structure
Authors
Keywords
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Journal
JOURNAL OF ALLOYS AND COMPOUNDS
Volume 493, Issue 1-2, Pages 431-437
Publisher
Elsevier BV
Online
2009-12-30
DOI
10.1016/j.jallcom.2009.12.119

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