Growth behaviors of intermetallic compounds at Sn–3Ag–0.5Cu/Cu interface during isothermal and non-isothermal aging

Published 2013 View Full Article

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Title
Growth behaviors of intermetallic compounds at Sn–3Ag–0.5Cu/Cu interface during isothermal and non-isothermal aging
Authors
Keywords
-
Journal
JOURNAL OF ALLOYS AND COMPOUNDS
Volume 574, Issue -, Pages 451-458
Publisher
Elsevier BV
Online
2013-05-31
DOI
10.1016/j.jallcom.2013.05.156

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