Employment of a bi-layer of Ni(P)/Cu as a diffusion barrier in a Cu/Sn/Cu bonding structure for three-dimensional interconnects

Published 2013 View Full Article

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Title
Employment of a bi-layer of Ni(P)/Cu as a diffusion barrier in a Cu/Sn/Cu bonding structure for three-dimensional interconnects
Authors
Keywords
-
Journal
ACTA MATERIALIA
Volume 61, Issue 18, Pages 6736-6742
Publisher
Elsevier BV
Online
2013-08-22
DOI
10.1016/j.actamat.2013.07.043

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