Extreme Bottom-Up Superfilling of Through-Silicon-Vias by Damascene Processing: Suppressor Disruption, Positive Feedback and Turing Patterns

MSA as a Supporting Electrolyte in Copper Electroplating for Filling of Damascene Trenches and Through Silicon Vias

(2011) Sung Ki Cho et al.   ELECTROCHEMICAL AND SOLID STATE LETTERS

Highly Selective Cu Electrodeposition for Filling Through Silicon Holes

(2011) Wei-Ping Dow et al.   ELECTROCHEMICAL AND SOLID STATE LETTERS

Effects of supporting electrolytes on copper electroplating for filling through-hole

(2011) Chien-Hung Chen et al.   ELECTROCHIMICA ACTA

Through-Hole Filling by Copper Electroplating Using a Single Organic Additive

(2010) Wei-Ping Dow et al.   ELECTROCHEMICAL AND SOLID STATE LETTERS

Fabrication and characterization of robust through-silicon vias for silicon-carrier applications

(2010) P. S. Andry et al.   IBM JOURNAL OF RESEARCH AND DEVELOPMENT

Three-dimensional silicon integration

(2010) J. U. Knickerbocker et al.   IBM JOURNAL OF RESEARCH AND DEVELOPMENT

Impact of Near-Surface Thermal Stresses on Interfacial Reliability of Through-Silicon Vias for 3-D Interconnects

(2010) Suk-Kyu Ryu et al.   IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY

Accelerator Surface Phase Associated with Superconformal Cu Electrodeposition

(2010) T. P. Moffat et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Copper plating for 3D interconnects

(2010) A. Radisic et al.   MICROELECTRONIC ENGINEERING

Superconformal Electrodeposition of Co and Co–Fe Alloys Using 2-Mercapto-5-benzimidazolesulfonic Acid

(2009) Chang Hwa Lee et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Adsorption and Desorption Kinetics of a Block Copolymer Wetting Agent Used in Copper Electroplating

(2009) Mark J. Willey et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Copper Filling of 100 nm Trenches Using PEG, PPG, and a Triblock Copolymer as Plating Suppressors

(2009) Joshua W. Gallaway et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Inhibition of Copper Deposition by Polyethylene Glycol and Chloride

(2009) M. E. Huerta Garrido et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Filling of microvia with an aspect ratio of 5 by copper electrodeposition

(2008) O. Lühn et al.   ELECTROCHIMICA ACTA

Hydration of Copper(II): New Insights from Density Functional Theory and the COSMO Solvation Model

(2008) Vyacheslav S. Bryantsev et al.   JOURNAL OF PHYSICAL CHEMISTRY A

Magnetic Materials for Three-Dimensional Damascene Metallization: Void-Free Electrodeposition of Ni and Ni[sub 70]Fe[sub 30] Using 2-Mercapto-5-benzimidazolesulfonic Acid

(2008) Chang Hwa Lee et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Voltammetric Study of the Inhibition Effect of Polyethylene Glycol and Chloride Ions on Copper Deposition

(2008) M. E. Huerta Garrido et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Inhibition of Copper Deposition by Polyethylene Glycol and Chloride

(2008) M. E. Huerta Garrido et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Selective Adsorption of Poly(ethylene oxide) onto a Charged Surface Mediated by Alkali Metal Ions†

(2007) Liraz Chai et al.   LANGMUIR