Journal
IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS
Volume 20, Issue 1, Pages 186-191Publisher
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/TVLSI.2010.2090049
Keywords
Microbumps; 3-D integration; through silicon via
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Reducing interconnect delay and power consumption has become a major concern in deep submicron designs. 3-D technologies have been proposed as a promising solution to mitigate interconnect problems. This paper examines the electrical characterization of vertical intertier connections such as through silicon via (TSV) and microbumps considering process variations and studies their timing impact on the circuit level. We first provide parasitic RC characteristics of intertier connections including TSV and microbumps and examine their delay. Then circuit simulation is performed to evaluate the timing impact of intertier connections.
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