Soft-template-assisted bottom-up fabrication of tunable porosity monolithic copper film for interconnection in microelectronics
出版年份 2023 全文链接
标题
Soft-template-assisted bottom-up fabrication of tunable porosity monolithic copper film for interconnection in microelectronics
作者
关键词
-
出版物
Journal of the Taiwan Institute of Chemical Engineers
Volume 152, Issue -, Pages 105192
出版商
Elsevier BV
发表日期
2023-10-26
DOI
10.1016/j.jtice.2023.105192
参考文献
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