Die-attach bonding at 230 °C using micron Sn-coated Zn particles for high-temperature applications
出版年份 2022 全文链接
标题
Die-attach bonding at 230 °C using micron Sn-coated Zn particles for high-temperature applications
作者
关键词
-
出版物
Journal of Materials Research and Technology-JMR&T
Volume 21, Issue -, Pages 4490-4499
出版商
Elsevier BV
发表日期
2022-11-17
DOI
10.1016/j.jmrt.2022.11.069
参考文献
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