Soft-template-assisted bottom-up fabrication of tunable porosity monolithic copper film for interconnection in microelectronics
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Title
Soft-template-assisted bottom-up fabrication of tunable porosity monolithic copper film for interconnection in microelectronics
Authors
Keywords
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Journal
Journal of the Taiwan Institute of Chemical Engineers
Volume 152, Issue -, Pages 105192
Publisher
Elsevier BV
Online
2023-10-26
DOI
10.1016/j.jtice.2023.105192
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