Interconnection method based on Cu-foam/Sn composite preform for high-temperature applications
出版年份 2022 全文链接
标题
Interconnection method based on Cu-foam/Sn composite preform for high-temperature applications
作者
关键词
-
出版物
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
Volume -, Issue -, Pages -
出版商
Springer Science and Business Media LLC
发表日期
2022-10-16
DOI
10.1007/s10854-022-09287-2
参考文献
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