Study of electroless Sn-coated Cu microparticles and their application as a high temperature thermal interface material

出版年份 2017 全文链接

标题

作者

关键词

Cu@Sn core-shell microparticles, Electroless Sn plating, Tin whisker, Interconnection, Thermal interface material

出版物

Volume 319, Issue -, Pages 230-240

出版商

Elsevier BV

发表日期

2017-04-04

DOI

10.1016/j.surfcoat.2017.04.002

联系作者

Explore over 38,000 international journals covering a vast array of academic fields.

Quickly pose questions to the entire community. Debate answers and get clarity on the most important issues facing researchers.

Get Started