Preparation, properties, and reliability of Cu/Sn composite joints with porous Cu as interlayer for high-temperature resistant packaging
出版年份 2023 全文链接
标题
Preparation, properties, and reliability of Cu/Sn composite joints with porous Cu as interlayer for high-temperature resistant packaging
作者
关键词
-
出版物
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
Volume 34, Issue 8, Pages -
出版商
Springer Science and Business Media LLC
发表日期
2023-03-29
DOI
10.1007/s10854-023-10123-4
参考文献
相关参考文献
注意:仅列出部分参考文献,下载原文获取全部文献信息。- Novel transient liquid phase bonding method using In-coated Cu sheet for high-temperature die attach
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