Cu-Cu joint with Sn-58Bi/Porous Cu/Sn-58Bi transient liquid phase bonding under formic acid atmosphere

An efficient method to engage oxide ceramics in low-temperature interfacial reactions: Microstructure evolution and kinetics behaviors based on supercooling in a transient liquid phase bonding joint

(2023) Jia Yang et al.   JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY

Cu3Sn joint based on transient liquid phase bonding of Cu@Cu6Sn5 core–shell particles

(2023) Jintao Wang et al.   Scientific Reports

Bonding Below 150°C Using Nano-Ag Film for Power Electronics Packaging

(2023) Zhongyang Deng et al.   JOURNAL OF ELECTRONIC MATERIALS

Low-Temperature Transient Liquid Phase Bonding Technology via Cu Porous-Sn58Bi Solid–Liquid System under Formic Acid Atmosphere

(2023) Siliang He et al.   Materials

Study on the floating kinetics of graphene in molten Sn-based alloy based on in-situ observation of X-ray radiography

(2022) Yuan Li et al.   COMPOSITES PART B-ENGINEERING

Transient liquid phase bonding (TLPB) of Cu to Cu using Sn interconnect solder reinforced by submicron Al particles

(2022) Lei Sun et al.   JOURNAL OF MATERIALS PROCESSING TECHNOLOGY

Behavior of Sn-3.0Ag-0.5Cu solder/Cu fluxless soldering via Sn steaming under formic acid atmosphere

(2022) Siliang He et al.   Journal of Materials Research and Technology-JMR&T

Microstructural and mechanical characteristics of Cu-Sn intermetallic compound interconnects formed by TLPB with Cu-Sn nanocomposite

(2022) Han Jiang et al.   Materials Today Communications

Quasi-in-situ observation on diffusion anisotropy dominated asymmetrical growth of Cu-Sn IMCs under temperature gradient

(2021) Yuanyuan Qiao et al.   ACTA MATERIALIA

Surface modification of Cu electroplated layers for Cu–Sn transient liquid phase bonding

(2021) Shao-Yu Hsu et al.   MATERIALS CHEMISTRY AND PHYSICS

Electrochemically Dealloyed Cu–Pt Nanostructures for Oxygen Reduction and Formic Acid Oxidation

(2021) Siniya Mondal et al.   ACS Applied Nano Materials

Formic Acid: A Hydrogen-Bonding Cocatalyst for Formate Decomposition

(2020) Benjamin W. J. Chen et al.   ACS Catalysis

Microstructure evolution and grain orientation of IMC in Cu-Sn TLP bonding solder joints

(2019) Lei Sun et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Effect of CuZnAl particles addition on microstructure of Cu/Sn58Bi/Cu TLP bonding solder joints

(2019) Mingyue Xiong et al.   VACUUM

Low temperature de-oxidation for copper surface by catalyzed formic acid vapor

(2018) Pei-Wen Chou et al.   APPLIED SURFACE SCIENCE

Highly Conductive Cu–Cu Joint Formation by Low-Temperature Sintering of Formic Acid-Treated Cu Nanoparticles

(2016) Jingdong Liu et al.   ACS Applied Materials & Interfaces

Low-pressure Cu-Cu bonding using in-situ surface-modified microscale Cu particles for power device packaging

(2016) Xiangdong Liu et al.   SCRIPTA MATERIALIA

Thermally stable Cu 3 Sn/Cu composite joint for high-temperature power device

(2016) Xiangdong Liu et al.   SCRIPTA MATERIALIA

Effect of Process and Service Conditions on TLP-Bonded Components with (Ag,Ni–)Sn Interlayer Combinations

(2015) Adrian Lis et al.   JOURNAL OF ELECTRONIC MATERIALS

Low Temperature Sintering Cu6Sn5Nanoparticles for Superplastic and Super-uniform High Temperature Circuit Interconnections

(2015) Ying Zhong et al.   Small

A Combined Process of Formic Acid Pretreatment for Low-Temperature Bonding of Copper Electrodes

(2013) Wenhua Yang et al.   ECS Journal of Solid State Science and Technology

Phase-field simulations of intermetallic compound growth in Cu/Sn/Cu sandwich structure under transient liquid phase bonding conditions

(2012) M.S. Park et al.   ACTA MATERIALIA

Interfacial reaction in Cu/Sn/Cu system during the transient liquid phase soldering process

(2010) J.F. Li et al.   ACTA MATERIALIA