Effect of Joule heating and current crowding on electromigration in mobile technology

Study of electromigration-induced formation of discrete voids in flip-chip solder joints by in-situ 3D laminography observation and finite-element modeling

(2016) Yuan-Wei Chang et al.   ACTA MATERIALIA

Joule heating induced thermomigration failure in un-powered microbumps due to thermal crosstalk in 2.5D IC technology

(2016) Menglu Li et al.   JOURNAL OF APPLIED PHYSICS

Flux-driven cellular precipitation in open system to form porous Cu3Sn

(2016) Andriy M. Gusak et al.   PHILOSOPHICAL MAGAZINE

Formation Mechanism of Porous Cu3Sn Intermetallic Compounds by High Current Stressing at High Temperatures in Low-Bump-Height Solder Joints

(2016) Jie-An Lin et al.   Crystals

Synergistic effect of electromigration and Joule heating on system level weak-link failure in 2.5D integrated circuits

(2015) Yingxia Liu et al.   JOURNAL OF APPLIED PHYSICS

Applications of three-dimensional LSI

(2015) Mitsumasa Koyanagi et al.   MRS BULLETIN

Three-dimensional integration: An industry perspective

(2015) Subramanian S. Iyer   MRS BULLETIN

Bewlay, Gradečak, Heilshorn, Spolenak, and Venkatesan to chair 2016 MRS Fall Meeting

(2015)   MRS BULLETIN

Material innovation opportunities for 3D integrated circuits from a wireless application point of view

(2015) S.Q. Gu   MRS BULLETIN

2015 MRS Spring Meeting highlights innovations and discoveries

(2015)   MRS BULLETIN

Materials challenges in three-dimensional integrated circuits

(2015) Kuan-Neng Chen et al.   MRS BULLETIN

A metastable phase of tin in 3D integrated circuit solder microbumps

(2015) Yingxia Liu et al.   SCRIPTA MATERIALIA

Electromigration kinetics and critical current of Pb-free interconnects

(2014) Minhua Lu et al.   APPLIED PHYSICS LETTERS

Influence of Cu column under-bump-metallizations on current crowding and Joule heating effects of electromigration in flip-chip solder joints

(2012) Y. C. Liang et al.   JOURNAL OF APPLIED PHYSICS

Blech effect in Pb-free flip chip solder joint

(2009) Minhua Lu et al.   APPLIED PHYSICS LETTERS

Thermomigration in Pb-free SnAg solder joint under alternating current stressing

(2009) Hsiang-Yao Hsiao et al.   APPLIED PHYSICS LETTERS

Effect of Sn grain orientation on electromigration degradation mechanism in high Sn-based Pb-free solders

(2008) Minhua Lu et al.   APPLIED PHYSICS LETTERS

Plastic deformation in Al (Cu) interconnects stressed by electromigration and studied by synchrotron polychromatic x-ray microdiffraction

(2008) Kai Chen et al.   JOURNAL OF APPLIED PHYSICS