Plastic deformation in Al (Cu) interconnects stressed by electromigration and studied by synchrotron polychromatic x-ray microdiffraction

Published 2008 View Full Article

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Title
Plastic deformation in Al (Cu) interconnects stressed by electromigration and studied by synchrotron polychromatic x-ray microdiffraction
Authors
Keywords
-
Journal
JOURNAL OF APPLIED PHYSICS
Volume 104, Issue 1, Pages 013513
Publisher
AIP Publishing
Online
2008-07-18
DOI
10.1063/1.2952073

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