Ball shear strength and fracture modes of lead-free solder joints prepared using nickel nanoparticle doped flux

Microstructures and fatigue life of SnAgCu solder joints bearing Nano-Al particles in QFP devices

(2014) Liang Zhang et al.   Electronic Materials Letters

In-situ alloying of Sn–3.5Ag solder during reflow through Zn nanoparticle addition and its effects on interfacial intermetallic layers

(2014) A.S.M.A. Haseeb et al.   INTERMETALLICS

Effects of metallic nanoparticle doped flux on the interfacial intermetallic compounds between lead-free solder ball and copper substrate

(2014) G.K. Sujan et al.   MATERIALS CHARACTERIZATION

Impact strength of Sn–3.0Ag–0.5Cu solder bumps during isothermal aging

(2014) JianXin Wang et al.   MICROELECTRONICS RELIABILITY

Enhanced ductility and mechanical strength of Ni-doped Sn–3.0Ag–0.5Cu lead-free solders

(2013) A.A. El-Daly et al.   MATERIALS & DESIGN

Impact of Ni concentration on the intermetallic compound formation and brittle fracture strength of Sn–Cu–Ni (SCN) lead-free solder joints

(2013) Chaoran Yang et al.   MICROELECTRONICS RELIABILITY

Analysis of high speed shear characteristics of Sn-Ag-Cu solder joints

(2012) Santosh Kumar et al.   Electronic Materials Letters

Influence of Ni nanoparticle on the morphology and growth of interfacial intermetallic compounds between Sn–3.8Ag–0.7Cu lead-free solder and copper substrate

(2012) S.L. Tay et al.   INTERMETALLICS

Influence of TiO2 nanoparticles on IMC growth in Sn–3.0Ag–0.5Cu–xTiO2 solder joints in reflow process

(2012) Y. Tang et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Effects of Co nanoparticle addition to Sn–3.8Ag–0.7Cu solder on interfacial structure after reflow and ageing

(2011) A.S.M.A. Haseeb et al.   INTERMETALLICS

Influence of SrTiO3 nano-particles on the microstructure and shear strength of Sn–Ag–Cu solder on Au/Ni metallized Cu pads

(2010) Tama Fouzder et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Additive Occupancy in the Cu6Sn5-Based Intermetallic Compound Between Sn-3.5Ag Solder and Cu Studied Using a First-Principles Approach

(2010) Feng Gao et al.   JOURNAL OF ELECTRONIC MATERIALS

Effect of nano Al2O3 additions on the microstructure, hardness and shear strength of eutectic Sn–9Zn solder on Au/Ni metallized Cu pads

(2010) Tama Fouzder et al.   MICROELECTRONICS RELIABILITY

Wettability and interfacial reactions of Sn–Ag–Cu/Cu and Sn–Ag–Ni/Cu solder joints

(2009) Jeong-Won Yoon et al.   JOURNAL OF ALLOYS AND COMPOUNDS