Additive Occupancy in the Cu6Sn5-Based Intermetallic Compound Between Sn-3.5Ag Solder and Cu Studied Using a First-Principles Approach

Published 2010 View Full Article

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Title
Additive Occupancy in the Cu6Sn5-Based Intermetallic Compound Between Sn-3.5Ag Solder and Cu Studied Using a First-Principles Approach
Authors
Keywords
-
Journal
JOURNAL OF ELECTRONIC MATERIALS
Volume 39, Issue 4, Pages 426-432
Publisher
Springer Nature
Online
2010-02-23
DOI
10.1007/s11664-010-1093-8

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