Effects of Co nanoparticle addition to Sn–3.8Ag–0.7Cu solder on interfacial structure after reflow and ageing

Published 2011 View Full Article

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Title
Effects of Co nanoparticle addition to Sn–3.8Ag–0.7Cu solder on interfacial structure after reflow and ageing
Authors
Keywords
-
Journal
INTERMETALLICS
Volume 19, Issue 5, Pages 707-712
Publisher
Elsevier BV
Online
2011-02-17
DOI
10.1016/j.intermet.2011.01.009

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