Microstructures and fatigue life of SnAgCu solder joints bearing Nano-Al particles in QFP devices

Effect of rare earth Ce on the fatigue life of SnAgCu solder joints in WLCSP device using FEM and experiments

(2014) Liang Zhang et al.   MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING

Low-temperature creep of SnPb and SnAgCu solder alloys and reliability prediction in electronic packaging modules

(2013) Yuming Zhang et al.   SCRIPTA MATERIALIA

Microstructures and Properties of SnZn Lead-Free Solder Joints Bearing La for Electronic Packaging

(2012) Liang Zhang et al.   IEEE TRANSACTIONS ON ELECTRON DEVICES

The influence of addition of nanosized molybdenum and nickel particles on creep behavior of Sn–Ag lead free solder alloy

(2012) V.L. Niranjani et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Suppressing effect of 0.5wt.% nano-TiO2 addition into Sn–3.5Ag–0.5Cu solder alloy on the intermetallic growth with Cu substrate during isothermal aging

(2011) L.C. Tsao   JOURNAL OF ALLOYS AND COMPOUNDS

Stability of molybdenum nanoparticles in Sn–3.8Ag–0.7Cu solder during multiple reflow and their influence on interfacial intermetallic compounds

(2011) A.S.M.A. Haseeb et al.   MATERIALS CHARACTERIZATION

Microstructure, kinetic analysis and hardness of Sn–Ag–Cu–1wt% nano-ZrO2 composite solder on OSP-Cu pads

(2010) Asit Kumar Gain et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Effects of nano-structured particles on microstructure and microhardness of Sn–Ag solder alloy

(2009) F. Tai et al.   JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS

Effects of rare earths on properties and microstructures of lead-free solder alloys

(2009) Liang Zhang et al.   JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS