The effects of solder volume and Cu concentration on the consumption rate of Cu pad during reflow soldering

Published 2009 View Full Article

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Title
The effects of solder volume and Cu concentration on the consumption rate of Cu pad during reflow soldering
Authors
Keywords
-
Journal
JOURNAL OF ALLOYS AND COMPOUNDS
Volume 492, Issue 1-2, Pages 99-104
Publisher
Elsevier BV
Online
2009-11-21
DOI
10.1016/j.jallcom.2009.11.088

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