JOURNAL OF ELECTRONIC PACKAGING

Note: The following journal information is for reference only. Please check the journal website for updated information prior to submission.

Journal Title

J ELECTRON PACKAGING

ISSN / eISSN

1043-7398 / 1528-9044

Aims and Scope

The Journal of Electronic Packaging publishes papers that use experimental and theoretical (analytical and computer-aided) methods, approaches, and techniques to address and solve various mechanical, materials, and reliability problems encountered in the analysis, design, manufacturing, testing, and operation of electronic and photonics components, devices, and systems.

Scope: Microsystems packaging; Systems integration; Flexible electronics; Materials with nano structures and in general small scale systems.

Subject Area

ENGINEERING, ELECTRICAL & ELECTRONIC

ENGINEERING, MECHANICAL

CiteScore

4.00

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CiteScore Ranking

Category	Quartile	Rank
Engineering - Mechanics of Materials	Q2	#150/391
Engineering - Electrical and Electronic Engineering	Q2	#305/738
Engineering - Computer Science Applications	Q2	#333/792
Engineering - Electronic, Optical and Magnetic Materials	Q2	#131/271

Web of Science Core Collection

Science Citation Index Expanded (SCIE)	Social Sciences Citation Index (SSCI)
Indexed	-

Category (Journal Citation Reports 2023)	Quartile
ENGINEERING, ELECTRICAL & ELECTRONIC - SCIE	Q4
ENGINEERING, MECHANICAL - SCIE	Q4

H-index

Country/Area of Publication

UNITED STATES

Publisher

American Society of Mechanical Engineers(ASME)

Publication Frequency

Quarterly

Annual Article Volume

Open Access

Contact

ASME-AMER SOC MECHANICAL ENG, THREE PARK AVE, NEW YORK, USA, NY, 10016-5990

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