Microstructural, thermal and mechanical properties of Co added Sn–0.7Cu lead-free solder alloy

Comprehensive study on structure, mechanical and nuclear shielding properties of lead free Sn–Zn–Bi alloys as a powerful radiation and neutron shielding material

(2022) A. Saleh et al.   RADIATION PHYSICS AND CHEMISTRY

Quasi-in-situ observation on diffusion anisotropy dominated asymmetrical growth of Cu-Sn IMCs under temperature gradient

(2021) Yuanyuan Qiao et al.   ACTA MATERIALIA

Controlling Ag3Sn Plate Formation and Its Effect on the Creep Resistance of Sn–3.0Ag–0.7Cu Lead-Free Solder by Adding Minor Alloying Elements Fe, Co, Te and Bi

(2020) A. M. El-Taher et al.   METALS AND MATERIALS INTERNATIONAL

The significance of strain weakening and self-annealing in a superplastic Bi–Sn eutectic alloy processed by high-pressure torsion

(2019) Chuan Ting Wang et al.   ACTA MATERIALIA

Effect of Bi on the microstructure and mechanical properties of Sn-Zn alloys processed by rolling

(2018) Guangyu Liu et al.   MATERIALS CHARACTERIZATION

Effects of Mn nanoparticles on tensile properties of low-Ag Sn-0.3Ag-0.7Cu-xMn solder alloys and joints

(2017) Y. Tang et al.   JOURNAL OF ALLOYS AND COMPOUNDS

A review of lead-free solders for electronics applications

(2017) Shunfeng Cheng et al.   MICROELECTRONICS RELIABILITY

Effects of cobalt on the nucleation and grain refinement of Sn-3Ag-0.5Cu solders

(2016) Z.L. Ma et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Design and performance of Ag nanoparticle-modified graphene/SnAgCu lead-free solders

(2016) Lianyong Xu et al.   MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING

The influence of Ni and Zn additions on microstructure and phase transformations in Sn–0.7Cu/Cu solder joints

(2015) Guang Zeng et al.   ACTA MATERIALIA

Development of new multicomponent Sn–Ag–Cu–Bi lead-free solders for low-cost commercial electronic assembly

(2015) A.A. El-Daly et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Novel Bi-containing Sn–1.5Ag–0.7Cu lead-free solder alloy with further enhanced thermal property and strength for mobile products

(2015) A.A. El-Daly et al.   MATERIALS & DESIGN

Effect of aluminum concentration on the microstructure and mechanical properties of Sn–Cu–Al solder alloy

(2015) Li Yang et al.   MICROELECTRONICS RELIABILITY

New Sn–0.7Cu-based solder alloys with minor alloying additions of Pd, Cr and Ca

(2014) Jahyun Koo et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Microstructures and Mechanical Properties of Sn-0.1Ag-0.7Cu-(Co, Ni, and Nd) Lead-Free Solders

(2014) Xu Chen et al.   JOURNAL OF ELECTRONIC MATERIALS

Co Effects upon Intermetallics Growth Kinetics in Sn-Cu-Co/Ni and Sn-Cu-Co/Cu Couples

(2014) Yan-lun Tseng et al.   JOURNAL OF ELECTRONIC MATERIALS

Mechanical properties of Sn–Ag lead-free solder alloys based on the dendritic array and Ag3Sn morphology

(2013) Wislei R. Osório et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Improved creep resistance and thermal behavior of Ni-doped Sn–3.0Ag–0.5Cu lead-free solder

(2013) A.A. El-Daly et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Evolution of thermal property and creep resistance of Ni and Zn-doped Sn–2.0Ag–0.5Cu lead-free solders

(2013) A.A. El-Daly et al.   MATERIALS & DESIGN

Reactive wetting, evolution of interfacial and bulk IMCs and their effect on mechanical properties of eutectic Sn–Cu solder alloy

(2011) Satyanarayan et al.   ADVANCES IN COLLOID AND INTERFACE SCIENCE

Microstructure, corrosion behaviour and microhardness of a directionally solidified Sn–Cu solder alloy

(2011) Wislei R. Osório et al.   ELECTROCHIMICA ACTA

Creep behavior of near-peritectic Sn–5Sb solders containing small amount of Ag and Cu

(2010) A.A. El-Daly et al.   MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING

Enhancement of heterogeneous nucleation of β-Sn phases in Sn-rich solders by adding minor alloying elements with hexagonal closed packed structures

(2009) Moon Gi Cho et al.   APPLIED PHYSICS LETTERS

Effects of Zn addition on microstructure and tensile properties of Sn–1Ag–0.5Cu alloy

(2009) H.Y. Song et al.   MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING

Effect of Mn on Sn–Ag–Cu ternary lead free solder alloy–Cu assembly: a comparative study

(2009) M. Ghosh et al.   MATERIALS SCIENCE AND TECHNOLOGY

An Investigation of Microstructure and Microhardness of Sn-Cu and Sn-Ag Solders as Functions of Alloy Composition and Cooling Rate

(2008) Sun-Kyoung Seo et al.   JOURNAL OF ELECTRONIC MATERIALS

Indentation creep of lead-free Sn–9Zn and Sn–8Zn–3Bi solder alloys

(2008) R. Mahmudi et al.   MATERIALS & DESIGN