Controlling Ag3Sn Plate Formation and Its Effect on the Creep Resistance of Sn–3.0Ag–0.7Cu Lead-Free Solder by Adding Minor Alloying Elements Fe, Co, Te and Bi
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Title
Controlling Ag3Sn Plate Formation and Its Effect on the Creep Resistance of Sn–3.0Ag–0.7Cu Lead-Free Solder by Adding Minor Alloying Elements Fe, Co, Te and Bi
Authors
Keywords
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Journal
METALS AND MATERIALS INTERNATIONAL
Volume -, Issue -, Pages -
Publisher
Springer Science and Business Media LLC
Online
2020-08-31
DOI
10.1007/s12540-020-00856-w
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